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首页> 外文期刊>JSME International Journal. Series A, Solid mechanics and material engineering >Study of Fatigue Crack Propagation Behavior of Film Materials (Fatigue Testing Method and Factors Controlling Fatigue Crack Propagation Rates)
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Study of Fatigue Crack Propagation Behavior of Film Materials (Fatigue Testing Method and Factors Controlling Fatigue Crack Propagation Rates)

机译：薄膜材料的疲劳裂纹扩展行为研究（疲劳测试方法和控制疲劳裂纹扩展速率的因素）

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摘要

At present, materials with small dimensions such as thin films are often used in electronic packaging. This study concerns a film fatigue testing method, which makes it possible to observe the fatigue crack propagation behavior on a film bonded to a through-hole in a base plate subjected to push-pull cyclic loads. An analytical model for this testing method is presented using a boundary element method, so that the film fatigue fracture can be treated quantitatively in terms of fracture mechanics (K-values and J-integrals). The fatigue crack growth properties were examined for commercial-grade iron films with 100 μm thickness bonded to either a circular or an elliptical hole in the base plate. As a result, using the stress intensity factor based on the measured crack opening displacement, ΔK_(est), the fatigue crack propagation behavior of the film could be understood in terms of the effective stress intensity factor widely used in the bulk specimen, ΔK_(eff).
机译：目前，电子包装中经常使用诸如薄膜之类的小尺寸材料。这项研究涉及一种薄膜疲劳测试方法，该方法可以观察在承受推拉循环载荷的基板上与通孔粘结的薄膜上的疲劳裂纹扩展行为。使用边界元方法给出了该测试方法的分析模型，从而可以根据断裂力学（K值和J积分）对膜疲劳断裂进行定量处理。对于厚度为100μm的商业级铁膜，将其粘结到基板上的圆形或椭圆形孔中，研究了疲劳裂纹扩展性能。结果，使用基于测得的裂纹张开位移ΔK_（est）的应力强度因子，可以根据大块试样中广泛使用的有效应力强度因子ΔK_（）来理解膜的疲劳裂纹扩展行为。 eff）。

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