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首页> 外文期刊>ISIJ international >Microstructures of Cutting Chips of SUS430 and SUS304 Steels, and NCF 750 and 6061-T6 Alloys
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Microstructures of Cutting Chips of SUS430 and SUS304 Steels, and NCF 750 and 6061-T6 Alloys

机译：SUS430和SUS304钢以及NCF 750和6061-T6合金切屑的显微组织

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摘要

Microstructures of chip specimens of high-strength materials produced by machining were examined by FE-SEM/EBSP method (an orientation imaging microscopy, OIM). In the ferritic SUS430 (16Cr) steel, the chip specimen with shear strain (γ) of ～7.5 was principally composed of equiaxed submicron grains which were for the most part surrounded by large angle grain boundaries (misorientation, θ≥15°). A similar microstructure was observed in the chip specimen with y≈ 22 of the Inconel X-750 (NCF 750) nickel-base alloy. However, the chip specimen of the austenitic SUS304 (18Cr-8Ni) steel (γ≈ 14) and that of the 6061-T6 (aluminum) alloy (γ≈ 10) exhibited principally a deformed microstructure with elongated grains and sub grains separated by small angle (2°≤9<5°) or medium angle grain boundaries (5°≤θ<15°), although equiaxed submicron grains were partly observed. The chip specimens exhibited very high hardness compared to the original materials except 6061-T6 alloy. The maximum hardness value (609 Hv) was observed in the chip specimen with y≈ 22 of the Inconel X-750 alloy. Strong particles with equiaxed submicron grain structure, which can be easily produced by milling of cutting chips of commercial alloys, will be potential strengthener for metal matrix composites.
机译：通过FE-SEM / EBSP方法（定向成像显微镜，OIM）检查了通过机械加工生产的高强度材料芯片试样的显微组织。在铁素体SUS430（16Cr）钢中，切变应变（γ）约为7.5的切屑试样主要由等轴的亚微米晶粒组成，这些亚微米晶粒大部分被大角度晶界包围（取向不良，θ≥15°）。在Inconel X-750（NCF 750）镍基合金的y≈22的芯片样品中观察到类似的微观结构。但是，奥氏体SUS304（18Cr-8Ni）钢（γ≈14）和6061-T6（铝）合金（γ≈10）的切屑试样主要表现出变形的组织，其拉长的晶粒和子晶粒被细小分开。角（2°≤9<5°）或中等角度的晶界（5°≤θ<15°），尽管部分观察到等轴亚微米晶粒。与6061-T6合金以外的原始材料相比，碎片样品具有很高的硬度。在Inconel X-750合金的y≈22的切屑样品中观察到最大硬度值（609 Hv）。具有等轴亚微米晶粒结构的强颗粒，可以通过铣削商用合金的切屑而轻松生产，将成为金属基复合材料的潜在增强剂。

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  • 来源
    《ISIJ international》 |2011年第7期|p.1142-1150|共9页
  • 作者

    Manabu TANAKA; Ryuichi KATO; Tadashi FUJITA; Rika YODA;

  • 作者单位

    Department of Mechanical Engineering, Faculty of Engineering and Resource Science, Akita University, 1-1 Tegatagakuen-cho, Akita, 010-8502 Japan;

    Department of Mechanical Engineering, Faculty of Engineering and Resource Science, Akita University, 1-1 Tegatagakuen-cho, Akita, 010-8502 Japan;

    Department of Mechanical Engineering, Faculty of Engineering and Resource Science, Akita University, 1-1 Tegatagakuen-cho, Akita, 010-8502 Japan;

    Technology Department, Electronics Division, Kobelco Research Institute Inc., 1-5-5 Takatsuka-dai, Nishi-ku, Kobe, 651-2271 Japan;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    chip specimen; submicron grains; fe-sem/ebsp method; machining;

    机译：芯片样本亚微米颗粒;fe-sem / ebsp方法;加工;

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