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机译:后刻蚀处理对28 nm节点及以上分子孔堆积/ Cu互连的影响
Renesas Electronics Corporation, 1120 Shimokuzawa, Chuou-ku, Sagamihara 252-5298, Japan;
Renesas Electronics Corporation, 1120 Shimokuzawa, Chuou-ku, Sagamihara 252-5298, Japan;
Renesas Electronics Corporation, 1120 Shimokuzawa, Chuou-ku, Sagamihara 252-5298, Japan;
Renesas Electronics Corporation, 1120 Shimokuzawa, Chuou-ku, Sagamihara 252-5298, Japan;
Renesas Electronics Corporation, 1120 Shimokuzawa, Chuou-ku, Sagamihara 252-5298, Japan;
Renesas Electronics Corporation, 1120 Shimokuzawa, Chuou-ku, Sagamihara 252-5298, Japan;
Renesas Electronics Corporation, 1120 Shimokuzawa, Chuou-ku, Sagamihara 252-5298, Japan;
Renesas Electronics Corporation, 1120 Shimokuzawa, Chuou-ku, Sagamihara 252-5298, Japan;
Renesas Electronics Corporation, 1120 Shimokuzawa, Chuou-ku, Sagamihara 252-5298, Japan;
Renesas Electronics Corporation, 1120 Shimokuzawa, Chuou-ku, Sagamihara 252-5298, Japan;
Renesas Electronics Corporation, 1120 Shimokuzawa, Chuou-ku, Sagamihara 252-5298, Japan;
机译:45纳米节点按比例缩小的铜互连与分子孔堆叠(MPS)SiOCH膜的可行性研究
机译:45纳米节点按比例缩小的铜互连与分子孔堆叠(MPS)SiOCH膜的可行性研究
机译:高度可靠的分子孔堆叠(MPS)/铜互连,具有蚀刻后处理和再溅射工艺的最佳结合
机译:蚀刻后处理(PET)对28nm节点及超出的分子孔堆叠(MPS)/ Cu互连的影响
机译:用于高级ULSI应用的Al(Cu)和Cu互连中的热应力和微观结构。
机译:温度梯度下Cu / Sn / Cu互连中液-固界面处Cu6Sn5金属间化合物的生长动力学
机译:用皮秒脉冲激光切割28-NM节点Cu / Low-k晶片的研究