Optimal Integration Process for Elimination of Abnormal Striation on Wafer Dual Damascene Processes

Chun-Jen Weng

首页> 外文期刊>Japanese journal of applied physics >Optimal Integration Process for Elimination of Abnormal Striation on Wafer Dual Damascene Processes

【24h】

Optimal Integration Process for Elimination of Abnormal Striation on Wafer Dual Damascene Processes

机译：消除晶圆双镶嵌工艺异常条纹的最佳集成工艺

获取原文

获取原文并翻译 | 示例

掌桥外文数据库（机构版） >>

开具论文收录证明 >>

文献代查 >>

页面导航

摘要
著录项
相似文献
相关主题

摘要

This paper is focused on optimal lithography processes using copper back-end-of-line (BEOL) semiconductor wafer integration technology and a solution to the problem of defect reduction on a semiconductor wafer. The pattern collapse observed in this process and numerous defects were prevented by optimizing the process module tuning. A novel semiconductor process on various pattern designs and deep pattern aspect ratio effects of a submicron semiconductor structure were included in this study. In addition to the experimental wafer manufacturing process, the electrical device data and defect reduction checking were also included.

机译：本文致力于采用铜后端（BEOL）半导体晶片集成技术的最佳光刻工艺，以及解决半导体晶片缺陷减少问题的解决方案。通过优化过程模块调整，可以在此过程中观察到图案塌陷，并避免了许多缺陷。这项研究包括一种新颖的半导体工艺，可用于各种图案设计以及亚微米半导体结构的深图案长宽比效应。除了实验性晶圆制造工艺外，还包括电子设备数据和缺陷减少检查。

著录项

来源
《Japanese journal of applied physics》 |2009年第4issue1期|295-300|共6页
作者
Chun-Jen Weng;
展开▼
作者单位

Department of Technology Management, Leader University, Tainan 709, Taiwan, R.O.C.;

展开▼
收录信息
原文格式 PDF
正文语种 eng
中图分类
关键词

相似文献

外文文献
中文文献
专利

1. Aqueous Based Single Wafer Cu/Low-k Cleaning Process Characterization and Integration into Dual Damascene Process Flow [J] . Jianshe Tang, Brian J. Brown, Steven Verhaverbeke, Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena . 2005,第0期

机译：基于水的单晶片Cu / Low-k清洗工艺表征并集成到双镶嵌工艺流程中
2. Novel Approach of Semiconductor Manufacturing Process on Copper Dual Damascene Processes Integration [J] . C.-J. Weng Strain . 2009,第3期

机译：铜双镶嵌工艺集成的半导体制造工艺新方法
3. Elimination of Resist Roisoning in Via-First Dual Damascene Processes [J] . Seiji Nagahara, Masashi Fujimoto, Mitsuharu Yamana, Journal of Photopolymer Science and Technology . 2003,第3期

机译：消除了首次通过双金属镶嵌工艺中的抗蚀剂中毒
4. Aqueous Based Single Wafer Cu/Low-k Cleaning Process Characterization and Integration into Dual Damascene Process Flow [C] . Jianshe Tang, Brian J. Brown, Steven Verhaverbeke, International Symposium on Ultra Clean Processing of Silicon Surfaces . 2005

机译：基于含水的单晶片Cu / Low-K清洁过程表征和集成到双镶嵌过程流程中
5. Damascene patterned metal/adhesive wafer bonding for three-dimensional integration. [D] . McMahon, J. Jay. 2008

机译：镶嵌图案化的金属/胶粘剂晶圆键合，用于三维集成。
6. The Modulating Role of Self-Referential Stimuli and Processes in the Effect of Stress and Negative Emotion on Inhibition Processes in Borderline Personality Disorder: Proposition of a Model to Integrate the Self-Concept and Inhibition Processes [O] . Jean Gagnon, Joséphine Aldebert, Gasser Saleh, 2019

机译：自我参照刺激和过程在压力和负性情绪对边缘人格障碍抑制过程的影响中的调节作用：整合自我概念和抑制过程的模型的提出
7. Aqueous Based Single Wafer Cu/Low-k Cleaning Process Characterization and Integration into Dual Damascene Process Flow [O] . Jianshe Tang, Brian J. Brown, Steven Verhaverbeke, 2015

机译：水基单晶硅Cu / Low-k清洗工艺表征与双镶嵌工艺流程的集成

Optimal Integration Process for Elimination of Abnormal Striation on Wafer Dual Damascene Processes

摘要

著录项

相似文献

相关主题

期刊订阅