首页> 外文期刊>Japanese Journal of Applied Physics. Part 1, Regular Papers, Brief Communications & Review Papers >Thermal Stability of Lanthanum Oxynitride Ultrathin Films Deposited on Silicon Substrates
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Thermal Stability of Lanthanum Oxynitride Ultrathin Films Deposited on Silicon Substrates

机译:沉积在硅基底上的氧氮化镧超薄膜的热稳定性

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摘要

We prepared lanthanum oxynitride films on p-type Si(100) substrates by electron beam evaporation. The films were deposited by evaporating lanthanum at a substrate temperature of 300 ℃, and introducing oxygen and nitrogen radicals into a chamber. After the thermal annealing of the films at 600 ℃ for 30 min, the composition and depth profile of the films were investigated by X-ray photoelectron spectroscopy (XPS) and Auger electron spectroscopy (AES), respectively. We found that lanthanum oxynitride films suppress Si diffusion from the substrate as compared with lanthanum oxide films.
机译:我们通过电子束蒸发在p型Si(100)衬底上制备了氧氮化镧薄膜。通过在300℃的衬底温度下蒸发镧,然后将氧和氮自由基引入腔室中来沉积薄膜。薄膜在600℃下热退火30min后,分别通过X射线光电子能谱(XPS)和俄歇电子能谱(AES)研究了薄膜的组成和深度分布。我们发现,与氧化镧膜相比,氧氮化镧膜抑制了Si从衬底的扩散。

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