Electric Breakdown and Conduction through Mylar Films

Inuishi Y.; Powers D. A.

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Electric Breakdown and Conduction through Mylar Films

机译：通过聚酯薄膜的电击穿和传导

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Dc breakdown studies on Mylar film show that defects cause a decrease in dielectric strength with decreasing film thickness at room temperature but not at -180°C. The breakdown at defects is associated with moisture content. Using self‐healing electrodes to eliminate weak areas, a dc dielectric strength of 6 Mv/cm is found, independent of film thickness. Prebreakdown current measurements indicate ionic currents which are fairly uniform throughout a sample, and field emission currents localized at incipient breakdown points. Breakdown probably occurs as a result of local heating by field emission currents.

机译：对聚酯薄膜的Dc击穿研究表明，缺陷会导致介电强度降低，在室温下会降低薄膜厚度，但在-180°C下不会降低。缺陷处的击穿与水分含量有关。使用自愈电极消除薄弱区域，发现直流绝缘强度为6 Mv / cm，与膜厚无关。击穿前的电流测量表明整个样品中离子电流相当均匀，场发射电流位于初始击穿点。击穿可能是由于场发射电流引起的局部加热而发生的。

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《Journal of Applied Physics》 |1957年第9期|共6页
作者
Inuishi Y.; Powers D. A.;
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Laboratory for Insulation Research, Massachusetts Institute of Technology, Cambridge, Massachusetts;

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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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正文语种 eng
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专利

1. High‐Field Conduction in Films of Mylar and Teflon [J] . Lilly A. C., McDowell John R. Journal of Applied Physics . 1968,第1期

机译：聚酯薄膜和聚四氟乙烯薄膜中的高场传导
2. Filamentary electrical conduction in polyimide films detected by infrared thermography before thermal breakdown [J] . S. Diaham, G. Belijar, M.-L. Locatelli, Applied Physics Letters . 2017,第16期

机译：热击穿前通过红外热像仪检测聚酰亚胺薄膜中的丝状导电
3. Trapping, conduction, and dielectric breakdown in Si/sub 3/N/sub 4/ films on as-deposition rugged polysilicon [J] . Chan H.C., Mathews V. IEEE Electron Device Letters . 1991,第9期

机译：沉积粗糙型多晶硅上Si / sub 3 / N / sub 4 /膜中的陷获，导电和介电击穿
4. Evidence of filamentary electrical conduction in polyimide films before breakdown using fast infrared thermography [C] . Diaham S., Belijar G., Locatelli M.-L., IEEE Conference on Electrical Insulation and Dielectric Phenomena . 2015

机译：快速红外热像仪击穿前聚酰亚胺薄膜中丝状导电的证据
5. The Effects of Processing Induced Damage on Electrical Conduction Mechanisms and Time-Dependent Dielectric Breakdown of Low-k Organosilicates. [D] . Nichols, Michael Thomas. 2013

机译：加工引起的损伤对低k有机硅酸盐的导电机理和时间依赖性介电击穿的影响。
6. Tuning the Electrical and Thermoelectric Properties of N Ion Implanted SrTiO3 Thin Films and Their Conduction Mechanisms [O] . Anuradha Bhogra, Anha Masarrat, Ramcharan Meena, -1

机译：氮离子注入SrTiO3薄膜的电和热电性质及其导电机理的调节
7. High-Electric Field Conduction and Dielectric Breakdown of Modified Poly-p-Xylylene Thin Films [O] . Tatsuo Mori, Teruyoshi Mizutani 1992

机译：改性聚对Xylylene薄膜的高电场传导和介电击穿
8. Electric Breakdown and Conduction through Mylar Films [R] . Y. Inuishi, D. A. Powers 1956

机译：mylar薄膜的电击穿和传导

Electric Breakdown and Conduction through Mylar Films

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