Thermal Stress and Plastic Deformation of Thin Silicon Slices

Morizane Kenji; Gleim Paul S.

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Thermal Stress and Plastic Deformation of Thin Silicon Slices

机译：薄硅片的热应力和塑性变形

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Thermal stress and subsequent plastic deformation can be caused in a thin slice of silicon by temperature gradients which arise during the transient periods of heat cycling. They arise either because of the radiation shielding effect of neighboring slices in a parallel row of slices, or the heat sink effect of the boat on which the slices stand, or because of the effect of both. Spacing between the parallel slices, type of boat used, heating and cooling rates, and furnace temperature affect the temperature gradients and the amount of plastic deformation. Study of slip patterns showed that the tangential component of thermal stress was responsible for slip, and that multiple slip was more common than single slip under the conditions investigated.

机译：在热循环瞬态期间出现的温度梯度会在硅薄片中引起热应力和随后的塑性变形。它们的出现是由于平行的一排切片中相邻切片的辐射屏蔽作用，或者是切片所站立的船的散热效果，或者是由于两者的作用。平行切片之间的间距，所用舟皿的类型，加热和冷却速率以及熔炉温度会影响温度梯度和塑性变形量。滑移模式的研究表明，热应力的切向分量是造成滑移的原因，在所研究的条件下，多滑移比单滑移更常见。

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来源
《Journal of Applied Physics》 |1969年第10期|共4页
作者
Morizane Kenji; Gleim Paul S.;
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作者单位

Texas Instruments, Incorporated, 13500 North Central Expressway, Dallas, Texas 75222;

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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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正文语种 eng
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Thermal Stress and Plastic Deformation of Thin Silicon Slices

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