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首页> 外文期刊>Journal of Crystal Growth >In situ anti-oxidation treatment in GaAs MOVPE by as desorption and passivation with AlP
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In situ anti-oxidation treatment in GaAs MOVPE by as desorption and passivation with AlP

机译:GaP MOVPE原位抗氧化AlP的解吸钝化处理

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摘要

In situ anti-oxidation treatment after the growth of GaAs is essential for an ideal interface between GaAs and an Al_2O_3 gate dielectric, because the arsenic oxide is a major origin of interface states. The growth of AlP epitaxial layer on the top of GaAs was proposed as a novel anti-oxidation passivation method. The A1P layer almost converted to Al_2O_3 upon air exposure, serving as both a stable anti-oxidation layer and as part of a gate dielectric. Compared with surface passivation with Al by exposure to TMAl (trimethylaluminum), which we have proposed previously, the morphology of the passivated surface, which is a critical factor for the performance of a metal-insulator-semiconductor (MIS) structure, was dramatically improved due to the coexistence of a group-V precursor. For an ideal interface without arsenic oxide, an arsenic-free surface prior to the AlP growth was also required. H_2S treatment allowed us to obtain the low-As-content c(8 × 2) surface reconstruction of GaAs for the first time by MOVPE. Passivation by AlP on the low-As-content c(8 × 2) surface reconstruction of GaAs has made it possible to obtain an Al_2O_3/GaAs gate stack which exhibited smooth morphology and complete suppression of arsenic oxide. Reduction of interface states by this passivation was evidenced by the improved photoluminescence intensity from GaAs.
机译:GaAs生长后的原位抗氧化处理对于GaAs与Al_2O_3栅极电介质之间的理想界面至关重要,因为氧化砷是界面态的主要来源。提出了在GaAs上生长AlP外延层作为一种新型的抗氧化钝化方法。暴露在空气中,AlP层几乎转化为Al_2O_3,既用作稳定的抗氧化层,又用作栅极电介质的一部分。与我们先前提出的通过暴露于TMAl(三甲基铝)对Al进行表面钝化相比,钝化表面的形貌显着改善,而钝化表面是影响金属-绝缘体-半导体(MIS)结构性能的关键因素由于第V组前体的共存。为了获得理想的无砷氧化物界面,在AlP生长之前还需要无砷表面。 H_2S处理使我们首次通过MOVPE获得了GaAs的低As含量c(8×2)表面重建。通过在GaAs的低As含量c(8×2)表面重建上进行AlP钝化,可以获得具有平滑形貌并完全抑制氧化砷的Al_2O_3 / GaAs栅叠层。 GaAs改善的光致发光强度证明了这种钝化对界面态的降低。

著录项

  • 来源
    《Journal of Crystal Growth》 |2010年第8期|p.1359-1363|共5页
  • 作者单位

    Department of Electrical Engineering and Information Systems, School of Engineering, the University of Tokyo, 2-11-16 Yayoi, Bunkyo-ku, Tokyo 113-8656, Japan;

    Department of Materials Engineering, School of Engineering, the University of Tokyo;

    Department of Electrical Engineering and Information Systems, School of Engineering, the University of Tokyo, 2-11-16 Yayoi, Bunkyo-ku, Tokyo 113-8656, Japan Research Center for Advanced Science and Technology, the University of Tokyo;

    Department of Electrical Engineering and Information Systems, School of Engineering, the University of Tokyo, 2-11-16 Yayoi, Bunkyo-ku, Tokyo 113-8656, Japan Institute of Engineering Innovation, School of Engineering the University of Tokyo;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    A1. Adsorption; A1. Desorption; A1. Surface processes; A3. Metalorganic vapor phase epitaxy; B2. Semiconducting III-V materials;

    机译:A1。吸附;A1。解吸A1。表面工艺;A3。金属有机气相外延;B2。半导体III-V材料;

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