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首页> 外文期刊>Journal of Crystal Growth >AlGaN/GaN HEMT grown on large size silicon substrates by MOVPE capped with in-situ deposited Si_3N_4
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AlGaN/GaN HEMT grown on large size silicon substrates by MOVPE capped with in-situ deposited Si_3N_4

机译:通过用原位沉积Si_3N_4覆盖的MOVPE在大尺寸硅衬底上生长AlGaN / GaN HEMT

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AlGaN/GaN high electron mobility transistors (HEMTs) have been grown on 4 and 6 in Si(111) substrates by metal organic vapor phase epitaxy (MOVPE). A record sheet resistance of 256 Ω/□ has been measured by contactless eddy current mapping on 4 in silicon substrates. The wafer also shows an excellent uniformity and the standard variation is 3.6Ω/□ over the whole wafer. These values were confirmed by Hall-Van der Pauw measurements. In the 2DEG at the AlGaN/GaN interface, the electron mobility is in the range of 1500-1800cm~2/Vs and the electron density is between 1.3 x 10~(13) and 1.7 x 10~(13)cm~(-2). The key step in obtaining these results is an in-situ deposited Si_3N_4 passivation layer. This in-situ Si_3N_4, deposited directly after AlGaN top layer growth in the MOVPE reactor chamber, not only prevents the stress relaxation in AlGaN/GaN hetero-structures but also passivates the surface states of the AlGaN cap layer. HEMT transistors have been processed on the epitaxial structures and the maximum source-drain current density is 1.1 A/mm for a gate-source voltage of 2 V. The current collapse is minimized thanks to in-situ Si_3N_4. First results on AlGaN/GaN structures grown on 6 in Si(111) are also presented.
机译:AlGaN / GaN高电子迁移率晶体管(HEMT)通过金属有机气相外延(MOVPE)在Si(111)基板上的4和6层上生长。通过在4个硅基板上进行非接触式涡流测绘,测得的记录薄层电阻为256Ω/□。晶圆还显示出出色的均匀性,整个晶圆的标准偏差为3.6Ω/□。这些值通过Hall-Van der Pauw测量得到证实。在AlGaN / GaN界面的2DEG中,电子迁移率在1500-1800cm〜2 / Vs的范围内,电子密度在1.3 x 10〜(13)至1.7 x 10〜(13)cm〜(- 2)。获得这些结果的关键步骤是原位沉积的Si_3N_4钝化层。直接在AlGaN顶层生长后在MOVPE反应室中沉积的这种原位Si_3N_4不仅可以防止AlGaN / GaN异质结构中的应力松弛,而且可以钝化AlGaN盖层的表面状态。 HEMT晶体管已在外延结构上进行了处理,并且对于2 V的栅极-源极电压,最大源极-漏极电流密度为1.1 A / mm。由于原位Si_3N_4,电流崩溃得以最小化。还介绍了在Si(111)中6上生长的AlGaN / GaN结构的初步结果。

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