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首页> 外文期刊>Journal of Electronic Packaging >Ultraminiaturized Three-Dimensional IPAC Packages with 100 μm Thick Glass Substrates for Radio Frequency Front-End Modules
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Ultraminiaturized Three-Dimensional IPAC Packages with 100 μm Thick Glass Substrates for Radio Frequency Front-End Modules

机译：超微型三维IPAC封装，带有100μm厚的玻璃基板，用于射频前端模块

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摘要

This paper presents innovative compact three-dimensional integrated passive and active components (3D IPAC) packages with ultrathin glass substrates for radio frequency (RF) long-term evolution (LTE) front-end modules (FEMs). High component density was achieved through double-side integration of substrate-embedded passives for impedance matching networks and three-dimensional (3D) double-side assembly of filters onto glass substrates. Glass with 100 μm thickness formed the core of the package, while four build-up layers with 15 μm thickness each were used to embed passives and form redistribution layers (RDLs). Advanced panel-scale double-side assembly processes were developed with low-cost mass reflow. Board-level assembly was realized with paste-printed solder balls and reflow on printed circuit board (PCB) with no intermediate substrates. Electrical performance of filters with substrate-embedded impedance matching networks was characterized and compared to simulations.
机译：本文介绍了创新的紧凑型三维集成无源和有源组件（3D IPAC）封装，其中包括用于射频（RF）长期演进（LTE）前端模块（FEM）的超薄玻璃基板。通过将用于阻抗匹配网络的嵌入衬底的无源器件进行双面集成，以及将滤镜的三维（3D）双面组装到玻璃衬底上，可以实现高组件密度。厚度为100μm的玻璃形成了封装的核心，而每个厚度为15μm的四个堆积层则用于嵌入无源层并形成再分布层（RDL）。开发了先进的面板规模的双面组装工艺，并具有低成本的大规模回流焊。板级组装是通过锡膏印刷的锡球实现的，并在没有中间基板的情况下在印刷电路板（PCB）上进行回流焊。表征了具有衬底嵌入式阻抗匹配网络的滤波器的电性能，并将其与仿真进行了比较。

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  • 来源
    《Journal of Electronic Packaging》 |2017年第4期|041001.1-041001.9|共9页
  • 作者

    Wu Zihan; Min Junki; Smet Vanessa; Pulugurtha Markondeya Raj; Sundaram Venky; Tummala Rao;

  • 作者单位

    3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, United States;

    3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, United States;

    3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, United States;

    3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, United States;

    3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, United States;

    3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, United States;

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  • 原文格式 PDF
  • 正文语种 eng
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  • 关键词

    embedding; filters; Front end; ultrathin glass;

    机译：嵌入过滤器前端;超薄玻璃;

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