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首页> 外文期刊>Journal of Electronic Packaging >Ball Grid Array Interconnection Properties of Solderable Polymer-Solder Composites with Low-Melting-Point Alloy Fillers
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Ball Grid Array Interconnection Properties of Solderable Polymer-Solder Composites with Low-Melting-Point Alloy Fillers

机译：具有低熔点合金填料的可焊聚合物-焊料复合材料的球栅阵列互连特性

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摘要

In this work, a novel ball grid array (BGA) interconnection process has been developed using solderable polymer-solder composites (SPCs) with low-melting-point alloy (LMPA) fillers to enhance the processability of the conventional capillary underfill technique and to overcome the limitations of the no-flow underfill technique. To confirm the feasibility of the proposed technique, a BGA interconnection test was performed using four types of SPCs with a different LMPA concentration (from 0 to 5 vol %). After the BGA interconnection process, the interconnection characteristics, such as morphology of conduction path and electrical properties of the BGA assemblies, were inspected and compared. The results indicated that BGA assemblies using SPC without LMPA fillers showed weak conduction path formation, including open circuit (solder bump loss) or short circuit formation because of the expansion of air voids within the interconnection area due to the relatively high reflow peak temperature. Meanwhile, assemblies using SPC with 3 vol % LMPAs showed stable metallurgical interconnection formation and electrical resistance due to the relatively low-reflow peak temperature and favorable selective wetting behavior of molten LMPAs for the solder bumps and Cu metallizations.
机译：在这项工作中，已经开发了一种新颖的球栅阵列（BGA）互连工艺，该工艺使用具有低熔点合金（LMPA）填料的可焊接聚合物-焊料复合材料（SPC）来增强常规毛细管底部填充技术的可加工性并克服无流动底部填充技术的局限性。为了确认所提出技术的可行性，使用了四种具有不同LMPA浓度（0至5体积％）的SPC进行了BGA互连测试。在BGA互连过程之后，检查并比较了互连特性，例如BGA组件的导电路径形态和电性能。结果表明，使用SPC而不使用LMPA填充剂的BGA组件显示出较弱的导电路径形成，包括开路（焊料凸块损耗）或短路形成，这是由于相对较高的回流峰值温度导致互连区域内的气孔膨胀所致。同时，由于具有相对较低的回流峰值温度和熔融LMPA对焊料凸点和Cu金属化的有利的选择性润湿行为，使用具有3％vol％LMPA的SPC的组件显示出稳定的冶金互连形成和电阻。

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  • 来源
    《Journal of Electronic Packaging》 |2017年第4期|041007.1-041007.9|共9页
  • 作者

    Yim Byungseung; Shin Youngeui; Kim Jongmin;

  • 作者单位

    Department of Mechanical Engineering, Kangwon National University, Gangwon-do, South Korea;

    School of Mechanical Engineering, Chung-Ang University, Seoul, South Korea;

    School of Mechanical Engineering, Chung-Ang University, Seoul, South Korea;

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