• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>Journal of Electronic Packaging >Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study
【24h】

Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study

机译：通过专利态势研究确定微电子封装中作为结合材料的烧结银（Ag）的发展状态

获取原文
获取原文并翻译 | 示例
           
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

Sintered silver joint is a porous silver that bonds a semiconductor die to the substrate as part of the packaging process. Sintered Ag is one of the few possible bonding methods to fulfill the operating conditions of wide band-gap (WBG) power device technologies. We review the current technology development of sintered Ag as a bonding material from the perspective of patents filed by various stakeholders since late 1980s. This review addresses the formulation of sintered pastes (i.e., nano-Ag, hybrid Ag, and micron Ag fillers), innovations in the process and equipment to form this Ag joint. This review will provide the insights and confidence to engineers, scientists from universities and industry as well as investors who are developing and commercializing the sintered Ag as a bonding material for microelectronic packaging.
机译：烧结银接头是一种多孔银，可作为封装过程的一部分将半导体管芯粘结到基板上。烧结银是满足宽带隙（WBG）功率器件技术操作条件的几种可能的键合方法之一。我们从1980年代后期以来各种利益相关者提交的专利的角度回顾了烧结银作为结合材料的当前技术发展。这篇评论论述了烧结膏的配方（即纳米银，混合银和微米银填料），形成这种银接头的工艺和设备方面的创新。这篇综述将为工程师和科学家以及来自大学和工业界的科学家以及正在开发和商业化烧结的银作为微电子封装的粘结材料并将其商业化的投资者提供见识和信心。

著录项

  • 来源
    《Journal of Electronic Packaging》 |2016年第2期|020804.1-020804.13|共13页
  • 作者

    K. S. Siow; Y. T. Lin;

  • 作者单位

    Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, Bangi 43600, Selangor D.E., Malaysia;

    Department of Business Management, College of Management, National Sun Yat-Sen University, No. 70, Lianhai Rd, Gushan District, Kaohsiung 804, Taiwan;

  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    sintered silver; lead free solders; die-attach materials; nanosilver;

    机译：烧结银无铅焊料;芯片连接材料;纳米银;

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号