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首页> 外文期刊>Journal of Electronic Packaging >Enhancement of Cooling Characteristics for Electronic Cooling by Modifying Substrate Under Natural Convection
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Enhancement of Cooling Characteristics for Electronic Cooling by Modifying Substrate Under Natural Convection

机译：通过自然对流对基板进行改性来增强电子冷却的冷却特性

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In this study, a computational fluid dynamics model has been developed to explain and validate the experimental results originating from the concept of a substrate with an opening. It is found that the openings will interrupt the growth of the boundary layer on substrate surfaces and hence improve the cooling ability of a module without any additional active parts. Furthermore, the concept of openings has not only so far provided at least 12% improvement in heat transfer, but also reduced some difficulties in finding thermal solution, such as the manufacturing cost and the design freedom. More importantly, this study has provided a further step in the direction of demonstrating the opening effect.
机译：在这项研究中，已开发了一种计算流体动力学模型来解释和验证源自带有开口的基材概念的实验结果。已经发现，这些开口将中断边界层在基板表面上的生长，并因此提高了没有任何附加有源部件的模块的冷却能力。此外，到目前为止，开口的概念不仅在传热方面提供了至少12％的改善，而且还减少了寻找热解决方案的难度，例如制造成本和设计自由度。更重要的是，这项研究为证明开放效果提供了进一步的步骤。

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