Calculation Method for Forced-Air Convection Cooling Heat Transfer Coefficient of Multiple Rows of Memory Cards

Takayuki Atarashi; Tetsuya Tanaka; Shigeyasu Tsubaki; Shigeki Hirasawa

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Calculation Method for Forced-Air Convection Cooling Heat Transfer Coefficient of Multiple Rows of Memory Cards

机译：多行存储卡强制空气对流冷却换热系数的计算方法

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Forced-air convection cooling of high-power electronic devices is widely used, but it has a problem that a rise in temperature of the air used to cool the upstream devices decreases the cooling capability for the downstream devices. In this study we made an experimental apparatus including a memory card array and measured the effect of the rise in temperature of the air on the heat transfer coefficient of the memory cards that were downstream in the air flow. Using these measurements, we devised a simple calculation model, called the thermal diffusion layer model, to calculate the heat transfer coefficient of multiple rows of memory cards. The rise in temperature of downstream memory cards due to higher temperature air can be evaluated with a parameter representing the delay of thermal mixing for air. The heat transfer coefficient calculated with the thermal diffusion layer model agreed with our experimental results.

机译：大功率电子设备的强制空气对流冷却被广泛使用，但是具有用于冷却上游设备的空气的温度升高降低了下游设备的冷却能力的问题。在这项研究中，我们制作了一个包含存储卡阵列的实验设备，并测量了空气温度升高对气流下游的存储卡的传热系数的影响。使用这些测量，我们设计了一个简单的计算模型，称为热扩散层模型，以计算多行存储卡的传热系数。可以通过代表空气热混合延迟的参数来评估由于空气温度较高而导致的下游存储卡的温度升高。用热扩散层模型计算出的传热系数与我们的实验结果一致。

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来源
《Journal of Electronics Cooling and Thermal Control》 |2014年第3期|70-77|共8页
作者
Takayuki Atarashi; Tetsuya Tanaka; Shigeyasu Tsubaki; Shigeki Hirasawa;
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作者单位

Hitachi, Ltd., Infrastructure Systems Company, Toshima, Tokyo, Japan,Department of Mechanical Engineering, Kobe University, Kobe, Japan;

Hitachi, Ltd., Infrastructure Systems Company, Toshima, Tokyo, Japan;

Hitachi, Ltd., Information and Telecommunication Systems Company, Hatano, Japan;

Department of Mechanical Engineering, Kobe University, Kobe, Japan;

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原文格式 PDF
正文语种 eng
中图分类
关键词
Forced Convection; Heat Transfer Performance; LSI Cooling; Memory Array;

机译：强制对流;传热性能;LSI冷却;记忆体阵列;

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Calculation Method for Forced-Air Convection Cooling Heat Transfer Coefficient of Multiple Rows of Memory Cards

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