...
  • 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>Journal of Energy Storage >Role of PCM based mini-channels for the cooling of multiple protruding IC chips on the SMPS board - A numerical study
【24h】

Role of PCM based mini-channels for the cooling of multiple protruding IC chips on the SMPS board - A numerical study

机译：基于PCM的微型通道在SMPS板上冷却多个突出IC芯片的作用-数值研究

获取原文
获取原文并翻译 | 示例
           
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

The paper aims at the transient numerical modelling under mixed convection for the cooling of seven protruding asymmetric IC chips mounted on an SMPS board using the phase change material (n-eicosane). The phase change material (PCM) is kept inside the mini-channels fabricated on the board. The objective is to bring down the temperature (minimize the maximum temperature) of the configuration (SMPS board with 7 IC chips) using the n-eicosane inside the mini-channels. It is seen that n-eicosane absorbs the heat dissipated by the IC chips and thus the maximum temperature of the configuration reduces by 5.5%. The effect of channel hydraulic diameter (2.5 mm <= D-h <= 3.5 mm) on the temperature of the IC chips is also studied. The results suggest that the mini- channel with lower hydraulic diameter gives a better rate of heat transfer from the IC chips and thus cools these effectively. The study is extended using four different phase change materials out of which, n-eicosane has resulted in maximum temperature drop from the IC chips among different PCMs due to its lower melting point value. A correlation is proposed for the non-dimensional temperature (theta) of the IC chips in terms of Fourier number (F-o) to predict the IC chip temperatures during the melting of PCM.
机译：本文旨在利用相变材料（正二十烷）冷却混合对流下的瞬态数值模型，以冷却安装在SMPS板上的七个突出的不对称IC芯片。相变材料（PCM）保持在板上制造的微型通道内。目的是使用微型通道内的正二十烷来降低配置（具有7个IC芯片的SMPS板）的温度（最小化最高温度）。可以看出，正二十烷吸收了IC芯片散发的热量，因此该结构的最高温度降低了5.5％。还研究了通道液压直径（2.5 mm <= D-h <= 3.5 mm）对IC芯片温度的影响。结果表明，具有较小水力直径的微型通道可以更好地从IC芯片传热，从而有效地冷却这些芯片。这项研究使用了四种不同的相变材料进行了扩展，其中正二十烷烷由于熔点较低，导致不同PCM中IC芯片的温度下降最大。提出了针对IC芯片的无量纲温度（θ）的傅立叶数（F-o）的相关性，以预测在PCM熔化期间IC芯片的温度。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号