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首页> 外文期刊>Journal of enhanced heat transfer >HEAT REMOVAL IMPROVEMENT IN AN ENCLOSURE WITH ELECTRONIC COMPONENTS FOR AIR CONDITIONING DEVICES
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HEAT REMOVAL IMPROVEMENT IN AN ENCLOSURE WITH ELECTRONIC COMPONENTS FOR AIR CONDITIONING DEVICES

机译：空调设备外壳中的除热改进

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摘要

The use of electronic components is increasing day by day, and cooling of these components to work properly is an important task for researchers. However, many small enterprises do not have any involvement in the design of the finned surfaces used to remove heat from electronic circuits. As a result, electronic card faults are frequently encountered. Environmental conditions and the rate of heat to be removed directly affect the cooling type. In this study, an electronic driver unit of an HVAC (heating, ventilating, and air conditioning) system operated in a dusty environment within an enclosure is analyzed. Initially, experiments are performed to model the operational temperatures inside the enclosure. Subsequently, validation of the results was carried out by numerical methods. After the validation of the results, the effects of fin spacing, fin thickness, base thickness, and heat sink positions were simulated. According to the performance improvement results, the temperatures of the triacs are decreased by 10.1% and 13.2%, respectively.
机译：电子组件的使用日益增加，对这些组件进行冷却以使其正常工作是研究人员的重要任务。但是，许多小型企业并未参与用于从电子电路中散热的带翅片表面的设计。结果，经常遇到电子卡故障。环境条件和要去除的热量会直接影响冷却方式。在这项研究中，分析了在封闭的多尘环境中运行的HVAC（加热，通风和空调）系统的电子驱动器单元。最初，进行实验以模拟外壳内部的工作温度。随后，通过数值方法对结果进行验证。在结果验证之后，模拟了散热片间距，散热片厚度，基础厚度和散热片位置的影响。根据性能改进结果，三端双向可控硅开关元件的温度分别降低了10.1％和13.2％。

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