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ENHANCED CONDUCTION AND POOL BOILING HEAT TRANSFER ON SINGLE-LAYER GRAPHENE-COATED SUBSTRATES

机译:单层经石墨烯包覆的基材上的强化传导和池沸腾传热

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摘要

Molecular dynamics simulations were employed to understand the improved thermal conductivity and water boiling heat transfer characteristics of adding single-layer graphene (SLG) to substrates. The 100, 110, and 111 planes of Cu, Ni, Pt, and Si were selected for study based on common heat transfer and graphene-compatible materials. Vibrational density of states data were analyzed in order to view heat flux trends. After equilibration at 300 K the temperature was increased to 400 K for 3 ns to induce nucleate boiling (similar to 27 K wall superheat). It was found that the addition of SLG greatly improved the overall thermal conductivity of the composite substrate, with increases in the one to two orders of magnitude range. The temperature gradients for SLG-coated substrates were found to be much lower than bare substrates. Nanoscale boiling curves were produced. The CuG100 case shows a 14% increase in critical heat flux (CHF) (similar to 0.36 GW/m(2)) over the Cu100 case, and the PtG100 shows a 9% increase (similar to 0.48 GW / m(2 )) over the Pt100 case. The SLG-coated substrates also required less superheat to achieve the CHF condition.
机译:使用分子动力学模拟来了解向基材中添加单层石墨烯(SLG)的改进的热导率和水沸腾传热特性。基于常见的传热和石墨烯相容材料,选择了Cu,Ni,Pt和Si的100、110和111平面进行研究。分析了状态的振动密度数据,以查看热通量趋势。在300 K平衡后,将温度升至400 K持续3 ns,以诱导核沸腾(类似于27 K壁过热)。已经发现,添加SLG极大地提高了复合衬底的整体导热率,并增加了一到两个数量级的范围。发现用于SLG涂层的基材的温度梯度远低于裸露的基材。产生了纳米级沸腾曲线。 CuG100案例显示的临界热通量(CHF)比Cu100案例增加了14%(类似于0.36 GW / m(2)),而PtG100案例显示了9%的临界热通量(CHF)增加(类似于0.48 GW / m(2))在Pt100外壳上。 SLG涂层的基材还需要较少的过热即可达到CHF条件。

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