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ENHANCED CONDUCTION AND POOL BOILING HEAT TRANSFER ON SINGLE-LAYER GRAPHENE-COATED SUBSTRATES

机译:在单层石墨烯涂层基材上增强导通和池沸腾热传递

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摘要

Molecular dynamics simulations were employed to understand the improved thermal conductivity and water boiling heat transfer characteristics of adding single-layer graphene (SLG) to substrates. The 100, 110, and 111 planes of Cu, Ni, Pt, and Si were selected for study based on common heat transfer and graphene-compatible materials. Vibrational density of states data were analyzed in order to view heat flux trends. After equilibration at 300 K the temperature was increased to 400 K for 3 ns to induce nucleate boiling (similar to 27 K wall superheat). It was found that the addition of SLG greatly improved the overall thermal conductivity of the composite substrate, with increases in the one to two orders of magnitude range. The temperature gradients for SLG-coated substrates were found to be much lower than bare substrates. Nanoscale boiling curves were produced. The CuG100 case shows a 14% increase in critical heat flux (CHF) (similar to 0.36 GW/m(2)) over the Cu100 case, and the PtG100 shows a 9% increase (similar to 0.48 GW / m(2 )) over the Pt100 case. The SLG-coated substrates also required less superheat to achieve the CHF condition.
机译:采用分子动力学模拟来了解加入单层石墨烯(SLG)的改善的导热性和水沸腾传热特性。选择100,111和111平面Cu,Ni,Pt和Si基于常见的传热和石墨烯 - 相容材料进行研究。分析了状态数据的振动密度以查看热量通量趋势。在300K平衡后,将温度升至400k,3 ns诱导核心沸腾(类似于27k壁过热)。发现添加SLG大大提高了复合衬底的总导热率,随着幅度的增加而增加。发现SLG涂覆的基材的温度梯度远低于裸衬底。产生纳米级沸腾曲线。 Cug100案例显示临界热通量(CHF)增加14%(类似于CH100案例的临界热通量(CHF)增加(类似于0.36 gw / m(2)),PTG100增加了9%的增加(类似于0.48 gw / m(2))在PT100案例上。 SLG涂覆的基材还需要更少的过热以达到CHF条件。

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