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Design, Fabrication, and Performance Evaluation of a Hybrid Wick Vapor Chamber

机译:混合灯芯蒸气腔的设计,制作和性能评估

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摘要

The growing electrification of transportation systems is dramatically increasing the waste heat that must be dissipated from high-density power electronics. Transformative embedded heat spreading technologies must be developed in next-generation systems to enable air cooling of power semiconductors with heat fluxes exceeding 500 W/cm(2) over large hotspot areas up to 1 cm(2). In this study, vapor chamber heat spreaders, or thermal ground planes (TGPs), with customized wick structures are investigated as one possibility. A 10 cm x 10 cm TGP with hybrid wick, which is a blend of a biporous wick with a standard monoporous wick, was designed. The TGP was tested in combination with a straight pin fin heat sink under air jet impingement and a 1 cm(2) size heat source. The experimental performance of the hybrid wick TGP was compared under the same air-cooled conditions with an off-the-shelf TGP of the same size from a commercial vendor and a TGP with a biporous wick only. The customized hybrid wick TGP exhibits similar to 28% lower thermal resistance compared with a traditional commercial TGP, and the capillary limit heat flux is measured as 450 W/cm(2). Technical challenges in extending this capillary limit heat flux value and TGP integration into packaged electronics are described.
机译:运输系统日益电气化,极大地增加了必须从高密度电力电子设备中散发的废热。必须在下一代系统中开发变换式嵌入式散热技术,以使功率通量最大可达1 cm(2)的热点区域的热通量超过500 W / cm(2)的空气冷却。在这项研究中,将蒸气室散热器或热接地板(TGP)(具有定制的灯芯结构)作为一种可能性进行了研究。设计了带有混合芯的10 cm x 10 cm TGP,它是双孔芯和标准单孔芯的混合物。在气流冲击下,将TGP与直针翅片散热器和1 cm(2)大小的热源结合进行测试。在相同的风冷条件下,将混合芯吸TGP的实验性能与商业供应商提供的相同尺寸的现成TGP和仅带有双孔芯吸的TGP进行了比较。定制的混合芯TGP与传统的商用TGP相比,热阻降低了28%,毛细管极限热通量的测量值为450 W / cm(2)。描述了扩展毛细管极限热通量值和将TGP集成到封装电子设备中的技术挑战。

著录项

  • 来源
    《Journal of Heat Transfer》 |2019年第8期|081802.1-081802.8|共8页
  • 作者单位

    Toyota Res Inst North Amer, 1555 Woodridge Ave, Ann Arbor, MI 48105 USA;

    Toyota Res Inst North Amer, 1555 Woodridge Ave, Ann Arbor, MI 48105 USA;

    Toyota Res Inst North Amer, 1555 Woodridge Ave, Ann Arbor, MI 48105 USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
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