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首页> 外文期刊>Journal of Heat Transfer >Orientation Effects on Pool Boling of Microporous Coating in Water
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Orientation Effects on Pool Boling of Microporous Coating in Water

机译：水中微孔涂层对池硼的取向效应

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摘要

Copper HTCMC (High-temperature, Thermally Conductive Microporous Coating) with a coating thickness of ~300 μm was created by sintering 67 μm copper particles onto a flat copper surface. This was shown to be the optimum particle size and thickness combination, in terms of boiling heat transfer enhancement with water, during a prior pool boiling study conducted by Jun et al. [1]. The effects of orientation of pool boiling heat transfer in saturated distilled water at 1 atm were tested experimentally and compared with a plain copper surface. An SEM image (top left) shows the porous structure of HTCMC demonstrating reentrant cavities which promote nucleate boiling and lead to significant critical heat flux (CHF) enhancement compared to the plain copper surface (top right). The nucleate boiling incipience heat flux of HTCMC was demonstrated to be 5 kW/m2, which was an 8x reduction when compared to a plain copper surface which was found to have an incipience heat flux of 40 kW/m2. At this same 40 kW/m2 heat flux, the activated nucleation site density of HTCMC was extremely high, and each bubble appeared much smaller compared to a plain surface. This can be seen in the first row of images, captured with a high speed camera at 2,000 fps. The bubble growth times and departing bubble sizes of 0° and 90° are comparable for both HTCMC and plain surfaces with the order of 10 milliseconds and 100 micrometers. However, when oriented at 180°, the bubble growth time was the order of 100 milliseconds for both HTCMC and plain surface, and the departing bubble size was the order of 10 millimeters. This is due to the growth of a large bubble which coalesced with adjacent bubbles to become a relatively huge bubble which was stretched by buoyance forces before the bubble departed.
机译：通过将67μm的铜颗粒烧结到平坦的铜表面上，制成涂层厚度约为300μm的HTCMC铜（高温，导热微孔涂层）。在Jun等人进行的先前的池沸腾研究中，就提高沸腾用水的传热性而言，这是最佳的粒径和厚度组合。 [1]。实验测试了在1个大气压的饱和蒸馏水中，池沸腾传热的方向影响，并与纯铜表面进行了比较。 SEM图像（左上方）显示了HTCMC的多孔结构，显示了凹腔，与普通的铜表面相比，凹腔促进了核沸腾并导致显着的临界热通量（CHF）增强。 HTCMC的核沸腾初生热通量为5 kW / m2，与发现初生热通量为40 kW / m2的纯铜表面相比，降低了8倍。在相同的40 kW / m2热通量下，HTMCC的活化成核位点密度非常高，与平坦表面相比，每个气泡显得小得多。这可以在第一行图像中看到，该图像是用高速相机以2,000 fps捕获的。对于HTCMC和平整表面，气泡的生长时间和0°和90°的离开气泡大小都差不多，大约为10毫秒和100微米。但是，当以180°定向时，对于HTCMC和平整表面，气泡的生长时间约为100毫秒，离开的气泡大小约为10毫米。这是由于大气泡的增长，该大气泡与相邻气泡合并而成为一个相对较大的气泡，该气泡在气泡离开之前被浮力拉伸。

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  • 来源
    《Journal of Heat Transfer》 |2017年第2期|020906.1-020906.1|共1页
  • 作者

    Seongchul Jun; Jinsub Kim; Hwan Yeol Kim; Seung M. You;

  • 作者单位

    Multi-Scale Heat Transfer Lab, Department of Mechanical Engineering, University of Texas at Dallas, Richardson, TX 75080, USA;

    Multi-Scale Heat Transfer Lab, Department of Mechanical Engineering, University of Texas at Dallas, Richardson, TX 75080, USA;

    Severe Accident & PHWR Safety Division, Korea Atomic Energy Research Institute (KAERI), Daejeon, KOREA;

    Multi-Scale Heat Transfer Lab, Department of Mechanical Engineering, University of Texas at Dallas, Richardson, TX 75080, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
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  • 正文语种 eng
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