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首页> 外文期刊>Journal of Heat Transfer >Optimal Time-Varying Heat Transfer in Multilayered Packages With Arbitrary Heat Generations and Contact Resistance
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Optimal Time-Varying Heat Transfer in Multilayered Packages With Arbitrary Heat Generations and Contact Resistance

机译：具有任意热量和接触电阻的多层封装中的时变传热最优

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摘要

Integrating the cooling systems of power electronics and electric machines (PEEMs) with other existing vehicle thermal management systems is an innovative technology for the next-generation hybrid electric vehicles (HEVs). As such, the reliability of PEEM must be assured under different dynamic duty cycles. Accumulation of excessive heat within the multilayered packages of PEEMs, due to the thermal contact resistance between the layers and variable temperature of the coolant, is the main challenge that needs to be addressed over a transient thermal duty cycle. Accordingly, a new analytical model is developed to predict transient heat diffusion inside multilayered composite packages. It is assumed that the composite exchanges heat via convection and radiation mechanisms with the surrounding fluid whose temperature varies arbitrarily over time (thermal duty cycle). As such, a time-dependent conjugate convection and radiation heat transfer is considered for the outer-surface. Moreover, arbitrary heat generation inside the layers and thermal contact resistances between the layers are taken into account. New closed-form relationships are developed to calculate the temperature distribution inside multilayered media. The present model is used to find an optimum value for the angular frequency of the surrounding fluid temperature to maximize the interfacial heat flux of composite media; up to 10% higher interfacial heat dissipation rate compared to constant fluid-temperature case. An independent numerical simulation is also performed using Comsol Multiphysics; the maximum relative difference between the obtained numerical data and the analytical model is less than 6%.
机译：将电力电子和电机（PEEM）的冷却系统与其他现有的车辆热管理系统集成在一起，是下一代混合电动汽车（HEV）的一项创新技术。因此，必须在不同的动态占空比下确保PEEM的可靠性。由于各层之间的热接触电阻和冷却剂温度的变化，PEEM多层封装中的过多热量积聚是需要在瞬态热占空比上解决的主要挑战。因此，开发了一种新的分析模型来预测多层复合包装内部的瞬态热扩散。假定该复合材料通过对流和辐射机制与周围流体交换热量，该周围流体的温度随时间（热工作循环）任意变化。因此，对于外表面考虑了时间相关的共轭对流和辐射热传递。此外，考虑了在层内部任意产生的热量以及层之间的热接触电阻。开发了新的封闭形式关系以计算多层介质内部的温度分布。本模型用于寻找周围流体温度角频率的最佳值，以使复合介质的界面热通量最大化。与恒定流体温度情况相比，界面散热率高出10％。还使用Comsol Multiphysics进行了独立的数值模拟。所得数值数据与分析模型之间的最大相对差小于6％。

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