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首页> 外文期刊>Journal of Heat Transfer >Thermal Resistance of Particle Laden Polymeric Thermal Interface Materials
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Thermal Resistance of Particle Laden Polymeric Thermal Interface Materials

机译：颗粒状聚合物热界面材料的热阻

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摘要

Particle laden polymers are one of the most prominent thermal interface materials (TIM) used in electronics cooling. Most of the research has primarily dealt with the understanding of the thermal conductivity of these types of TIMs. For thermal design, reduction of the thermal resistance is the end goal. Thermal resistance is not only dependent on the thermal conductivity, but also on the bond line thickness (BLT) of these TIMs. It is not clear which material property(s) of these particle laden TIMs affects the BLT and eventually the thermal resistance. This paper introduces a rheology based semiempirical model for the prediction of the BLT of these TIMs. BLT depends on the yield stress of the panicle laden polymer and the applied pressure. The BLT model combined with the thermal conductivity model can be used for modeling the thermal resistance of these TIMs for factors such as particle volume faction, particle shape, base polymer viscosity, etc. This paper shows that there exists an optimal filler volume fraction at which thermal resistance is minimum. Finally this paper develops design rules for the optimization of thermal resistance for particle laden TIMs.
机译：载有颗粒的聚合物是电子冷却中最杰出的热界面材料（TIM）之一。大多数研究主要涉及对这些类型的TIM的热导率的理解。对于热设计，降低热阻是最终目标。热阻不仅取决于导热率，还取决于这些TIM的键合线厚度（BLT）。目前尚不清楚这些载有颗粒的TIM的哪些材料性能会影响BLT，并最终影响热阻。本文介绍了一种基于流变学的半经验模型来预测这些TIM的BLT。 BLT取决于负载圆锥花序的聚合物的屈服应力和施加的压力。 BLT模型与热导率模型相结合可用于对这些TIM的热阻进行建模，例如颗粒体积分布，颗粒形状，基础聚合物粘度等因素。本文表明存在最佳填料体积分数，热阻最小。最后，本文提出了优化载有颗粒的TIM的热阻的设计规则。

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