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首页> 外文期刊>Journal of Coated Fabrics >A Study on the Fabrication Parameters and Dielectric Properties of PTFE Composites Filled with A1_2O_3andSiO_2 Nanoparticles
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A Study on the Fabrication Parameters and Dielectric Properties of PTFE Composites Filled with A1_2O_3andSiO_2 Nanoparticles

机译：纳米Al2_2O_3和SiO_2填充PTFE复合材料的制备参数和介电性能研究。

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In order to fabricate and enhance the composites with dielectric functions, printed circuit boards (PCBs) were made from polytetrafluoroethylene (PTFE) gel after curing with 350°C. SiO_2 and Al_2O_3 nanopowders were used as the fillers and PTFE was the matrix used to fabricate the composites. A proposed stirring machine was used to conduct the compounding process, which can assist in the uniform distribution of nano-Al_2O_3 and nano-SiO_2 powders in PTFE. The PTFE gel was mixed in the proposed stirring machine. Following stirring, molding and calendaring were done to release air bubbles and to increase the surface uniformity and smoothness of PCBs. Finally, PCBs were fabricated after cooling and sintering processes. Several kinds of PCBs were made by varying a wide range of fabrication parameters which included: percentage of particles added, size of particles added, different fabrication procedures, rotational speeds of the stirring machine, sintering, and cooling temperature, and calendaring times. Influences of these parameters and fabrication conditions on the dielectric properties of PCBs were investigated. This study established that there are some fabrication parameters due to which we get the worst dielectric properties of PCBs. Therefore, the optimum fabrication conditions and affecting factors of the board were investigated. As a result of this research, it was concluded that both dielectric constant and loss factor of the board were decreased by the addition of SiO_2 and A1_2O_3 nanoparticles and the optimum rotational speed of stirring machine is 3000rpm. Dielectric properties of PCBs were increased at speeds above 3000 rpm.
机译：为了制造和增强具有介电功能的复合材料，在350°C固化后，由聚四氟乙烯（PTFE）凝胶制成印刷电路板（PCB）。 SiO_2和Al_2O_3纳米粉被用作填料，而PTFE是用于制造复合材料的基质。使用建议的搅拌机进行混合过程，可以帮助纳米Al_2O_3和纳米SiO_2粉末在PTFE中均匀分布。在建议的搅拌机中混合PTFE凝胶。搅拌后，进行成型和压延以释放气泡并增加PCB的表面均匀性和光滑度。最后，在冷却和烧结过程之后制作PCB。通过改变各种制造参数可以制成几种PCB，这些参数包括：添加颗粒的百分比，添加颗粒的大小，不同的制造程序，搅拌机的转速，烧结和冷却温度以及压延时间。研究了这些参数和制造条件对PCB介电性能的影响。这项研究建立了一些制造参数，使我们得到了最差的PCB介电性能。因此，研究了板的最佳制造条件和影响因素。研究结果表明，通过加入SiO_2和Al_2O_3纳米粒子可以降低电路板的介电常数和损耗因子，搅拌机的最佳转速为3000rpm。 PCB的介电性能在3000 rpm以上的速度下会增加。

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