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首页> 外文期刊>Journal oflaser Applications >Two-laser deflating of heat sinks in integrated circuit packages
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Two-laser deflating of heat sinks in integrated circuit packages

机译：集成电路封装中的散热器的两次激光放气

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摘要

During the plastic packaging process, mold Hash is usually formed on a heat sink. In order to keep efficient heat transfer from the integrated circuit device to the exterior environment, the mold flash must be removed from the heat sink surface. In this paper, we demonstrate that a Nd:YAG laser deflashing is only available to remove thin Hash of a few micrometers from heat sinks and cannot remove thick flash without damage to the heat sink, both from experimental and numerical analysis. Based on optical and thermal properties of heat sink and mold flash materials, we develop a two-laser deflashing technique for thick flash removal. A CO_2 laser is used to remove the top layer of thick flash followed by Nd:YAG laser at low laser fluence and pulse number, which is used to remove the remaining thin flash without damaging the heat sink.
机译：在塑料包装过程中，通常在散热器上形成模具哈希。为了保持从集成电路器件到外部环境的有效热传递，必须从散热器表面去除铸型毛边。在本文中，我们通过实验和数值分析表明，Nd：YAG激光去毛刺仅可用于从散热器中去除几微米的薄哈希，并且无法去除厚毛刺而不会损坏散热器。基于散热片和铸型毛坯材料的光学和热学性质，我们开发了一种用于厚毛坯去除的两激光脱毛技术。使用CO_2激光去除较厚的闪光的顶层，然后使用低激光通量和脉冲数的Nd：YAG激光去除较薄的闪光，而不会损坏散热器。

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  • 来源
    《Journal oflaser Applications》 |2009年第1期|23-26|共4页
  • 作者

    W. D. Song; Q. Xie;

  • 作者单位

    Data Storage Institute, Agency of Seience, Technology and Researeh, DSI Building, 5, Engineering Drive I, Singapore 117608, Singapore;

    Data Storage Institute, Agency of Seience, Technology and Researeh, DSI Building, 5, Engineering Drive I, Singapore 117608, Singapore;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    laser deflashing; CO_2 laser; Nd:YAG laser; IC packages; heat sinks; thick flash;

    机译：激光去毛刺;CO_2激光;Nd：YAG激光;IC封装;散热片;浓密的闪光;

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