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Effects of punching process on crystal orientations, magnetic and mechanical properties in non-oriented silicon steel

机译:冲孔工艺对无取向硅钢晶体取向,磁性和力学性能的影响

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摘要

In an attempt to investigate the effects of punching process on crystal orientations, magnetic and mechanical properties in non-oriented silicon steel, the steel sheet was punched for circular shape of Φ40 mm. The crystal orientations and small-angle grain boundaries were characterized by electron backscatter diffraction (EBSD). The results indicated that the initial crystal orientations within a distance of 200 μm away from the sheared edge were significantly changed after the punching process. In this area, the fractions of the directions with a high value of magnetocrystalline anisotropy energy E_a, 〈1 1 1〉, 〈2 1 2〉 and 〈1 1 2〉 can reach up to 0.619. However, the fractions of the directions 〈0 0 1〉 and 〈1 1 3〉 accounts for only 0.096, which have a lower value of E_a. Moreover, the fraction of small-angle grain boundaries markedly increased in the area of about 200 μm from the sheared edge, which is mainly attributed to the dislocations multiplication and dislocations motion. The magnetic domain structures were characterized by an optical microscope according to the Bitter method. The results showed that the width of magnetic domain in the sheared edge was much larger than that in the center and the patterns also existed a big difference. The Vickers HV_(0.1) method was employed to measure the microhardness of the sheared edge. It was found that the values of microhardness within a distance of 400 μm away from the sheared edge decreased from 259 to 167 due to the effect of work hardening, which is mainly caused by the dislocations pile-ups near the grain boundaries.
机译:为了研究冲孔工艺对无取向硅钢的晶体取向,磁性和机械性能的影响,将钢板冲孔成Φ40mm的圆形。晶体取向和小角度晶界通过电子背散射衍射(EBSD)表征。结果表明,在冲切过程之后,距剪切边缘200μm处的初始晶体取向发生了显着变化。在该区域中,具有高磁晶各向异性能E_a,& 1 1 1&,& 2 1 2&和& 1 1 2&的方向的分数可以达到0.619。然而,方向<0 0 1>和<1 1 3>的分数仅占0.096,具有较低的E_a值。此外,小角晶界的比例在距剪切边缘约200μm的区域内显着增加,这主要归因于位错倍增和位错运动。根据Bitter方法,通过光学显微镜表征磁畴结构。结果表明,剪切边缘的磁畴宽度远大于中心的磁畴宽度,并且图案也存在较大差异。使用维克斯HV_(0.1)方法测量剪切边缘的显微硬度。结果表明,由于加工硬化的影响,在距剪切边缘400μm处的显微硬度值从259降低到167,这主要是由于晶界附近的位错堆积所致。

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  • 来源
    《Journal of magnetism and magnetic materials》 |2017年第12期|211-217|共7页
  • 作者单位

    State Key Laboratory of Materials Processing and Die & Mould Technology, College of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China;

    State Key Laboratory of Materials Processing and Die & Mould Technology, College of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China;

    State Key Laboratory of Materials Processing and Die & Mould Technology, College of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China;

    State Key Laboratory of Materials Processing and Die & Mould Technology, College of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China;

    State Key Laboratory of Materials Processing and Die & Mould Technology, College of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China;

    National Engineering Research Center for Silicon Steel, Wuhan Iron and Steel Group Corp, Wuhan, China;

    National Engineering Research Center for Silicon Steel, Wuhan Iron and Steel Group Corp, Wuhan, China;

    Research and Development Center, Wuhan Iron and Steel Group Corp, Wuhan, China;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Crystal orientation; Magnetic domain structure; Microhardness; Non-oriented silicon steel; Small-angle grain boundary;

    机译:晶体取向磁畴结构;显微硬度;无取向硅钢;小角度晶界;

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