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首页> 外文期刊>Journal of Manufacturing Processes >Modelling intermetallic phase growth during high-power ultrasonic welding of copper and aluminum
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Modelling intermetallic phase growth during high-power ultrasonic welding of copper and aluminum

机译:在铜和铝的大功率超声焊接过程中模拟金属间相的生长

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摘要

An analytical model was developed to understand the rapid growth mechanism of intermetallic compounds (IMC) interlayer in high-power ultrasonic welding process. The analytic solution was derived for the relationships among welding time, interface temperature and vacancy concentration. The effectiveness of this model was tested by comparing the predicted thickness with the experimental value for high-power ultrasonic welding of copper and aluminium at various amplitudes. The consistency of the comparison demonstrates the accuracy of the model has been improved by considering the dynamic change process of vacancy concentration. Besides, the effects of vibration amplitude and resistance heat on the increasing of the intermetallic thickness have been investigated independently. The results show that the additional heat source could significantly promote the process of ultrasonic welding.
机译:建立了一个分析模型,以了解大功率超声焊接过程中金属间化合物(IMC)夹层的快速生长机理。推导了焊接时间,界面温度和空位浓度之间关系的解析解。通过将预测厚度与不同振幅下铜和铝的高功率超声焊接的实验值进行比较,测试了该模型的有效性。比较的一致性表明,通过考虑空位浓度的动态变化过程可以提高模型的准确性。此外,还单独研究了振动幅度和电阻热对金属间厚度增加的影响。结果表明,额外的热源可以显着促进超声焊接过程。

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