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首页> 外文期刊>Journal of Manufacturing Processes >Effect of transient liquid phase bonding time on the microstructure, isothermal solidification completion and the mechanical properties during bonding of Inconel 625 superalloy using Cr-Si-B-Ni filler metal
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Effect of transient liquid phase bonding time on the microstructure, isothermal solidification completion and the mechanical properties during bonding of Inconel 625 superalloy using Cr-Si-B-Ni filler metal

机译：瞬时液相键合时间对Cr-Si-B-Ni填充Inconel 625高温合金焊接时的微观结构，等温凝固完成和力学性能的影响

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摘要

The effect of bonding time on microstructure and mechanical properties of a transient liquid phase (TLP) bonded Inconel 625 superalloy, using a BNi-2 interlayer, was investigated. The superalloy was kept in a vacuum furnace at a pressure of 10(-5) ton and a temperature of 1025 degrees C for 35, 65 and 95 min until TIP process occurred. Microstructure analyses were performed using optical microscopy (OM), scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDS). Microhardness examinations and shear tests were performed to determine the effect of bonding time on the mechanical behavior of TLP bonded joints. By increasing the bonding time, the diffusion of melting point depressant (MPD) increased and the isothermal solidification zone (ISZ) was completed. Isothermal solidification was completed at 1025 degrees C by 95 min bonding time. Also, by increasing the bonding time to 95 min, that caused the reduction of the eutectic phase, the ISZ widened and the hardness increased. At the bonding time of 35 min the amount of shear strength was 208.7 MPa, while by increasing the bonding time to 95 min, this amount increased to 448.9 MPa. So, the stress concentration factors decreased by reduction of the eutectic phases, which caused an increase in the shear strength.
机译：研究了粘合时间对使用BNi-2中间层的瞬态液相（TLP）粘合Inconel 625高温合金的微观结构和力学性能的影响。将超级合金在10（-5）吨的压力和1025摄氏度的温度下的真空炉中放置35、65和95分钟，直到发生TIP工艺。使用光学显微镜（OM），扫描电子显微镜（SEM）和能量色散X射线光谱仪（EDS）进行微观结构分析。进行了显微硬度检查和剪切试验，以确定粘结时间对TLP粘结接头的机械性能的影响。通过增加键合时间，降低了熔点降低剂（MPD）的扩散，并完成了等温固化区（ISZ）。等温固化在1025摄氏度下通过95分钟的粘合时间完成。同样，通过将键合时间增加到95分钟，这导致共晶相的减少，ISZ变宽，硬度增加。在粘合时间为35分钟时，剪切强度为208.7 MPa，而通过将粘合时间增加至95分钟，该剪切强度将增加至448.9 MPa。因此，应力集中系数由于共晶相的减少而减小，这导致了剪切强度的增加。

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