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Fracture sequences during elastic-plastic indentation of brittle materials

机译：脆性材料弹塑性压痕过程中的断裂顺序

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摘要

A fracture analysis is developed for crack initiation sequences occurring during sharp indentation of brittle materials. Such indentations, generated by pyramidal or conical loading, generate elastic and plastic deformation. The analysis uses a nonlinear elements-in-series model to describe indentation load-displacement responses, onto which lateral, radial, cone, and median crack initiation points are located. The crack initiation points are determined by extension and application of a contact stress-field model coupled to the indentation load, originally developed by Yoffe, in combination with crack nuclei coupled to the indentation displacement to arrive at an explicit fracture model. Parameters in the analysis are adapted directly from experimental fracture and deformation measurements, and the analysis outputs are directly comparable to experimental observations. After adaptation, crack initiation loads and sequences during indentation loading and unloading of glasses and crystals are predicted by the model from material modulus, hardness, and toughness values to within about 25% of peak contact load. This work is dedicated to George M. Pharr IV on the occasion of his 65th birthday in recognition of his contributions to indentation mechanics.
机译：针对在脆性材料的急剧压痕过程中出现的裂纹萌生顺序进行了断裂分析。由锥体或圆锥形载荷产生的这种压痕会产生弹性和塑性变形。该分析使用非线性串联模型来描述压痕载荷-位移响应，横向，径向，圆锥和正中裂纹起始点位于其上。裂纹的起始点是通过扩展和应用与压痕载荷耦合的接触应力场模型确定的，该模型最初是由Yoffe开发的，结合了与压痕位移耦合的裂纹核，从而得出了明确的断裂模型。分析中的参数直接根据实验的断裂和变形测量值进行调整，并且分析输出可直接与实验观察结果进行比较。适应后，该模型可以从材料模量，硬度和韧性值到峰值接触载荷的约25％以内，预测玻璃和晶体在压痕载荷和卸载过程中的裂纹萌生载荷和顺序。这项工作是为纪念乔治·M·法尔四世（George M. Pharr IV）65岁生日而献给他的，以表彰他对压痕力学的贡献。

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  • 来源
    《Journal of Materials Research》 |2019年第10期|1633-1644|共12页
  • 作者

    Cook Robert F.;

  • 作者单位

    NIST, Mat Measurement Sci Div, Gaithersburg, MD 20899 USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    fracture; hardness; nano-indentation;

    机译：断裂;硬度;纳米压痕;

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