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Directed block copolymer self-assembly for nanoelectronics fabrication

机译:定向嵌段共聚物自组装,用于纳米电子制造

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摘要

This paper provides an overview of directed self-assembly (DS A) options that exhibit potential for enabling extensible high-volume patterning of nanoelectronics devices. It describes the current set of research requirements, which a DSA technology must satisfy to warrant insertion consideration, and summarizes the state-of-the art. The primary focus is on chemical patterning and graphoepitaxial approaches to directing block copolymer (BCP) based assembly. These options exhibit the nearest-term potential, among the emerging DSA technologies, for satisfying projected International Technology Roadmap for Semiconductors (ITRS) patterning requirements. The paper concludes with a selected set of additional challenges, which represent potential barriers to the integration of directed BCP patterning into a nanoelectronics manufacturing line, as well as a few emerging application opportunities for related functional materials. A glossary of acronyms and terms may be found at the end of this manuscript.
机译:本文概述了定向自组装(DS A)选件,这些选件具有实现纳米电子器件可扩展的大容量图案化潜力的潜力。它描述了当前的一组研究要求,DSA技术必须满足这些研究要求以保证插入考虑,并总结了最新技术。主要重点是化学图案化和石墨外延方法,以指导基于嵌段共聚物(BCP)的组装。这些选件在新兴的DSA技术中显示出近期的潜力,可以满足预计的国际半导体技术路线图(ITRS)图案化要求。本文以一组选定的其他挑战作为结尾,这些挑战代表了将定向BCP图案集成到纳米电子生产线中的潜在障碍,以及相关功能材料的一些新兴应用机会。首字母缩略词和术语的词汇表可以在本文档的末尾找到。

著录项

  • 来源
    《Journal of Materials Research》 |2011年第2期|p.122-139|共18页
  • 作者

    Daniel J.C. Herr;

  • 作者单位

    Semiconductor Research Corporation, Research Triangle Park, North Carolina 27709;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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