Electromigration-induced strain relaxation in Cu conductor lines

H. Zhang; G.S. Cargill III

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Electromigration-induced strain relaxation in Cu conductor lines

机译：电迁移引起的铜导线应变松弛

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Strain evolution in 0.45-μim-thick, 2-μm-wide, and 100-μm-long Cu conductor lines with a passivation layer has been investigated using synchrotron x-ray microdiffraction. A moderate electromigration-current density of 2.2 x 105 A/cm2 was used to minimize Joule heating in the Cu conductor lines. After 120 h of current flowing in the Cu lines at 270 °C, measurements show strain relaxation and homogenization occurring in the Cu lines with current flowing, but not in Cu conductor lines without current. Stronger interaction between electrons with Cu atoms in areas with higher strains was proposed to explain the observation.

机译：使用同步加速器X射线微衍射研究了0.45μm厚，2μm宽和100μm长的带有钝化层的铜导线的应变演化。使用2.2 x 105 A / cm2的适度电迁移电流密度以最小化Cu导线中的焦耳热。在270°C下在Cu线中流过120 h的电流后，测量结果显示，在有电流流过的Cu线中发生了应变松弛和均质化，而在没有电流的Cu导体中没有发生应变松弛和均质化。有人提出，在应变较高的区域，电子与铜原子之间的相互作用更强，以解释这一现象。

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来源
《Journal of Materials Research》 |2011年第4期|p.498-502|共5页
作者
H. Zhang; G.S. Cargill III;
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作者单位

Cascade Engineering Services Inc., Redmond, Washington 98052;

Department of Materials Science and Engineering, Lehigh University, Bethlehem, Pennsylvania 18015;

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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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正文语种 eng
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Electromigration-induced strain relaxation in Cu conductor lines

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