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首页> 外文期刊>Journal of Materials Research >Measurement of Seebeck coefficient of electroplated thermoelectric films in presence of a seed layer
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Measurement of Seebeck coefficient of electroplated thermoelectric films in presence of a seed layer

机译：种子层存在下电镀热电薄膜的塞贝克系数的测量

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摘要

Effect of the seed layer on Seebeck coefficient measurement of electroplated thermoelectric films was quantitatively analyzed. It is found that sheet, rather than bulk resistance of the seed layer, or more precisely its relative comparison to sheet resistance of the film, determines the effects. The analysis reveals that the seed layer's effect can be neglected (within 1% error) only if the sheet resistance ratio [R_(□2)(film)/R_(□1)(seed)] is smaller than 0.01. This condition commonly requires film thicknesses of 100 um or more, which is not practically relevant. Based on the analysis we proposed a new method that is applicable for 10 times thinner films. This approach for determining Seebeck coefficient is simple, and more importantly, electroplated films can be characterized in their statu nascendi. Finite element simulation and experiments verified the analysis.
机译：定量分析了种子层对电镀热电薄膜塞贝克系数测量的影响。已经发现，薄板而不是种子层的体电阻，或更确切地说，其与膜的薄板电阻的相对比较，决定了效果。分析表明，只有当薄层电阻比[R_（□2）（薄膜）/ R_（□1）（种子）]小于0.01时，才能忽略种子层的影响（误差在1％以内）。该条件通常要求膜厚度为100 um或更大，这在实际中并不重要。在分析的基础上，我们提出了一种适用于10倍薄膜的新方法。确定塞贝克系数的这种方法很简单，更重要的是，电镀膜可以按其状态进行表征。有限元模拟和实验验证了该分析。

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  • 来源
    《Journal of Materials Research》 |2011年第15期|p.1953-1957|共5页
  • 作者

    Hai P. Nguyen; Jiale Su; Ziyang Wang; Ruud J.M. Vullers; Philippe M. Vereecken; Jan Fransaer;

  • 作者单位

    Department of Metallurgy and Materials Engineering, Katholic University of Leuven, Heverlee 3001, Belgium;

    IMEC/Holst Centre, Eindhoven, 040 4020400, The Netherlands;

    IMEC/Holst Centre, Eindhoven, 040 4020400, The Netherlands;

    IMEC/Holst Centre, Eindhoven, 040 4020400, The Netherlands;

    IMEC, Heverlee 3001, Belgium Center for Surface Chemistry and Catalysis, Katholic University of Leuven, Leuven B-3001, Belgium;

    Department of Metallurgy and Materials Engineering, Katholic University of Leuven, Heverlee 3001, Belgium;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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