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Comparative Investigation Of Strength And Plastic Instability In Cu/au And Cu/cr Multilayers By Indentation

机译:压痕法对Cu / au和Cu / cr多层膜强度和塑性不稳定性的比较研究

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The mechanical response to indentation (including nano- and microindentation) has been investigated in Cu/Au and Cu/Cr multilayers with respective layer thickness ratios of 1:1 and 2:1, and individual layer thickness ranging from nanometer to submicrometer scale. It was found that the Cu/Cr multilayer has higher strength than the Cu/Au multilayer, although both multilayers have close Hall-Petch slope. Examination of indentation-induced deformation behavior shows that the Cu/Cr multilayer exhibits higher resistance to plastic deformation instability than the Cu/Au multilayer. Theoretical analysis indicates that the significant difference in mechanical response originates from the constituent layer configuration and interface structures, which impose distinguishing confining effect on dislocation activity.
机译:在具有各自的层厚比为1:1和2:1的Cu / Au和Cu / Cr多层膜中,已经研究了对压痕(包括纳米压痕和微压痕)的机械响应。发现Cu / Cr多层具有比Cu / Au多层更高的强度,尽管两个多层都具有接近的Hall-Petch斜率。压痕引起的变形行为的研究表明,Cu / Cr多层板比Cu / Au多层板具有更高的抗塑性变形不稳定性的能力。理论分析表明,力学响应的显着差异源于组成层的结构和界面结构,这对位错活动具有明显的局限作用。

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