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首页> 外文期刊>Journal of Materials Research >Transmission Electron Microscopy Study Of The Deformation Behavior Of Cub And Cui Nanoscale Multilayers During Nanoindentation
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Transmission Electron Microscopy Study Of The Deformation Behavior Of Cub And Cui Nanoscale Multilayers During Nanoindentation

机译：纳米压痕过程中Cu / nb和Cu / ni纳米多层膜的变形行为的透射电镜研究

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摘要

Nanoscale metallic multilayers, comprising two sets of materials-Cu/Nb and Cu/Ni-were deposited in two different layer thicknesses-nominally 20 and 5 nm. These multilayer samples were indented, and the microstructural changes under the indent tips were studied by extracting samples from underneath the indents using the focused ion beam (FIB) technique and by examining them under a transmission electron microscope (TEM). The deformation behavior underneath the indents, manifested in the bending of layers, reduction in layer thickness, shear band formation, dislocation crossing of interfaces, and orientation change of grains, has been characterized and interpreted in terms of the known deformation mechanisms of nanoscale multilayers.
机译：包括两组材料-Cu / Nb和Cu / Ni-的纳米级金属多层膜以标称20和5 nm的两种不同层厚度沉积。对这些多层样品进行压痕，并通过使用聚焦离子束（FIB）技术从压痕下面提取样品并在透射电子显微镜（TEM）下进行检查，研究了压痕尖端下的微结构变化。凹痕下面的变形行为，表现为层的弯曲，层厚度的减小，剪切带的形成，界面的位错交叉以及晶粒的取向变化，已经根据纳米级多层的已知变形机理进行了表征和解释。

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