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首页> 外文期刊>Journal of Materials Research >Strong bonding of titanium to copper through the elimination of the brittle interfacial intermetallics
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Strong bonding of titanium to copper through the elimination of the brittle interfacial intermetallics

机译：通过消除脆性的界面金属间化合物，使钛与铜牢固结合

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摘要

The microstructures, interfacial reactions, and bonding strength properties of the Ti-Cu dissimilar joints using a commercially available Ag-28Cu-2Ti filler were studied, particularly as they relate to the role of an Ag barrier layer at the Ti interface. A joint microstructure and interfacial reactions closely related to the formation of brittle interfacial Ti-Cu intermetallics were fully dominated by the presence of the Ag layer at the Ti interface. Reliable Ti(base)/TiAg/Ag/Ag-Cu eutectic/Cu(base) joints without any detrimental Ti-Cu intermetallics were achieved at low brazing temperatures below 810 ℃ by applying an Ag interlayer of suitable thickness. It was notable that their bonding strengths were strong enough to exceed the strength of a Cu bulk base metal. This research demonstrates the potential application of an Ag interlayer for the reliable Ti-Cu dissimilar joints.
机译：研究了使用可商购的Ag-28Cu-2Ti填料的Ti-Cu异种接头的微观结构，界面反应和结合强度特性，尤其是它们与Ti界面处的Ag阻挡层的作用有关。与脆性界面Ti-Cu金属间化合物的形成密切相关的接头微观结构和界面反应完全被Ti界面处的Ag层存在所支配。在810℃以下的低钎焊温度下，通过施加合适厚度的Ag中间层，可获得可靠的Ti（基）/ TiAg / Ag / Ag-Cu共晶/​​ Cu（基）接头，而没有任何有害的Ti-Cu金属间化合物。值得注意的是，它们的结合强度足够强到超过Cu本体金属的强度。这项研究证明了Ag中间层在可靠的Ti-Cu异种接头中的潜在应用。

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