...
  • 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>Journal of Materials Research >Study of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process
【24h】

Study of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process

机译：无铅倒装焊锡凸块过冷的研究和凝固过程的现场观察

获取原文
获取原文并翻译 | 示例
           
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

The undercooling of flip-chip Pb-free solder bumps was investigated by differential scanning calorimetry (DSC) to understand the effects of solder composition and volume, with and without the presence of an under bump metallurgy (UBM). A large amount of the undercooling (as large as 90℃) was observed with Sn-rich, flip-chip size solder bumps sitting in a glass mold, while the corresponding undercooling was significantly reduced in the presence of a wettable UBM surface. In addition, the solidification of an array of individual solder bumps was monitored in situ by a video imaging technique during both heating-up and cooling-down cycles. Data obtained by the optical imaging method were used to complement the DSC thermal measurements. A random solidification of the array of bumps was demonstrated during cooling, which also spans a wide temperature range of 40-80℃. In contrast, an almost simultaneous melting of the bumps was observed during heating.
机译：通过差示扫描量热法（DSC）研究了倒装芯片无铅焊料凸块的过冷情况，以了解有无凸块下冶金（UBM）时焊料成分和体积的影响。如果将富锡，倒装芯片尺寸的焊料凸点放在玻璃模具中，则会观察到大量的过冷（高达90℃），而在存在可湿性UBM表面的情况下，相应的过冷则明显降低。另外，在加热和冷却循环期间，通过视频成像技术就地监视单个焊料凸块阵列的固化。通过光学成像方法获得的数据用于补充DSC热测量。在冷却过程中，发现了凸点阵列的随机凝固，这也跨越了40-80℃的宽温度范围。相反，在加热过程中观察到凸起几乎同时熔化。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号