Early dissolution behavior of copper in a molten Sn-Zn-Ag solder

Chang-Ho Yu; Kwang-Lung Lin

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Early dissolution behavior of copper in a molten Sn-Zn-Ag solder

机译：铜在熔融Sn-Zn-Ag焊料中的早期溶解行为

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The early dissolution behavior of Cu in a molten Sn-Zn-Ag solder was studied at 250 deg C by fast quenching the dissolving specimen in liquid nitrogen. The atomic level dissolution behavior of Cu in the molten solder was revealed by high-resolution transmission electron microscopy. The dissolution of Cu occurs through channel dissolution and thermal vibrational dissolution. The dissolution channel has a dimension of less than 0.5 nm. The formation of channels, and thus the channel zone, is initiated by preferential removal of Cu atoms from the surface vacant site of Cu lattice. Relict strips of lattice between channels subsequently dissolve into the molten solder with the aid of thermal vibration and the interaction with liquid Zn atoms. The dissolved atoms form an atomic cluster zone. These clusters are the intermediate state of the dissolution of Cu from the channel zone into the molten Sn-Zn-Ag solder. The clusters convert into an amorphous structure prior to further formation of compound.

机译：通过在液态氮中快速淬火溶解样品，研究了Cu在熔融Sn-Zn-Ag焊料中的早期溶解行为，温度为250摄氏度。通过高分辨率透射电子显微镜揭示了铜在熔融焊料中的原子级溶解行为。 Cu的溶解通过通道溶解和热振动溶解发生。溶解通道的尺寸小于0.5 nm。通过优先从Cu晶格的表面空位去除Cu原子来开始形成通道，从而形成通道区。通道之间的晶格残留条带随后借助热振动和与液态Zn原子的相互作用溶解到熔融焊料中。溶解的原子形成原子簇区域。这些簇是铜从通道区溶解到熔融的Sn-Zn-Ag焊料中的中间状态。在进一步形成化合物之前，团簇转化为无定形结构。

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来源
《Journal of Materials Research》 |2005年第3期|p.666-671|共6页
作者
Chang-Ho Yu; Kwang-Lung Lin;
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作者单位

Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan 701, Republic of China;

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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
原文格式 PDF
正文语种 eng
中图分类工程材料学;
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2. On the factors affecting the dissolution of copper in molten lead-free solders and development of a method to assess the soldering parameters [J] . D. Di Maio, C. P. Hunt Soldering & Surface Mount Technology . 2009,第4期

机译：影响铜在熔融无铅焊料中溶解的因素及评估焊接参数的方法的发展
3. Dissolution behavior of the Ni substrate and Ni3Sn4 phase in molten lead-free solders [J] . Y. W. Yen, C. Y. Lin, J. Yan, International Journal of Modern Physics, B. Condensed Matter Physics, Statistical Physics, Applied Physics . 2018,第19期

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4. SENSITIVITY OF COPPER DISSOLUTION TO THE FLOW BEHAVIOR OF MOLTEN SN-PB SOLDER [C] . P. T. Vianco, J. A. Rejent, A. C. Kilgo, SMTA international conference . 2014

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5. Orientation distribution, morphology, and size distribution of copper-tin intermetallic compound in reactions between molten solder and copper in flip chip solder joints. [D] . Suh, Jongook. 2006

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Early dissolution behavior of copper in a molten Sn-Zn-Ag solder

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