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首页> 外文期刊>Journal of Materials Research >Effect of temperature on the cure shrinkage measurement of non-conductive adhesives for flip chip interconnects
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Effect of temperature on the cure shrinkage measurement of non-conductive adhesives for flip chip interconnects

机译：温度对倒装芯片互连非导电粘合剂固化收缩率测量的影响

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摘要

Non-conductive adhesive (NCA) flip chip interconnects are emerging as attractive alternatives to lead or lead-free solder interconnects due to their environmental friendliness, lower processing temperatures, and extendability to fine pitch applications. The electrical connectivity of a NCA interconnect relies solely on the pure mechanical contact between the integrated circuit bump and the substrate pad; the electrical conductivity of the contact depends on the mechanical contact pressure, which in turns depends to a large extend on cure shrinkage characteristic of the NCA. In addition, to reduce the cost and increase the output, NCA is usually ramped up to 200 deg C and cured for 1 min during the assembly process. However, fast cure reaction poses a great challenge for the accurate measurement of cure shrinkage. In this paper, to precisely determine the cure shrinkage at high temperature, cure shrinkage was first measured at lower temperatures with slow reaction rate by means of thermomechanical analyzer and then extrapolated to high temperatures. With the increase of cure temperature, the maximum of degree of cure will increase, but the maximum cure shrinkage reduces due to the expansion of materials at higher cure temperature. Furthermore, the slopes of the linear relationship between the cure shrinkage and the degree of cure at different cure temperatures after gelation were found to be similar and independent of the cure temperature. The cure shrinkage from gel-point to complete curing was determined to be 4.275 percent.
机译：非导电粘合剂（NCA）倒装芯片互连由于其对环境友好，较低的处理温度以及可扩展到小间距应用的优点而成为有铅或无铅焊料互连的有吸引力的替代品。 NCA互连的电气连通性完全取决于集成电路凸点和衬底焊盘之间的纯机械接触；触点的导电性取决于机械接触压力，而机械接触压力又很大程度上取决于NCA的固化收缩特性。另外，为了降低成本并增加产量，NCA通常在组装过程中升至200摄氏度并固化1分钟。但是，快速的固化反应对准确测量固化收缩率提出了巨大的挑战。在本文中，为精确确定高温下的固化收缩率，首先通过热机械分析仪在较低的温度下以缓慢的反应速率测量固化收缩率，然后推断出高温。随着固化温度的升高，最大固化度将增加，但是由于较高固化温度下材料的膨胀，最大固化收缩率降低。此外，发现在胶凝后在不同固化温度下固化收缩率和固化程度之间的线性关系的斜率是相似的，并且与固化温度无关。从凝胶点到完全固化的固化收缩率被确定为4.275％。

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  • 来源
    《Journal of Materials Research》 |2005年第5期|p.1324-1329|共6页
  • 作者

    H. Yu; S. G. Mhaisalkar; E. H. Wona;

  • 作者单位

    School of Materials Science & Engineering, Nanyang Technological University, Singapore 639798;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 工程材料学;
  • 关键词

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