Effect of sample size on the solidification temperature and microstructure of SnAgCu near eutectic alloys

R. Kinyanjui; L.P. Lehman; L. Zavalij

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Effect of sample size on the solidification temperature and microstructure of SnAgCu near eutectic alloys

机译：样品大小对低共熔合金中SnAgCu凝固温度和组织的影响

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The degree of undercooling of Sn in near eutectic, SnAgCu solder balls upon cooling at a rate of 1 deg C/s from the melt was examined and found to increase linearly with inverse nominal sample diameter (for balls of radius between 100 and 1000 mu m). The mean undercooling for SnAgCu solder balls in a flip chip assembly was 62 deg C. The microstructures of these different samples were examined by means of scanning electron microscopy. The Sn dendrite arm width was observed to monotonically increase with ball diameter, indicating a possible dependence of the mechanical response of such solder balls upon size.

机译：从熔体以1℃/ s的速度冷却后，对接近共晶SnAgCu焊球中Sn的过冷度进行了检查，发现其与样品名义直径的倒数成线性关系（对于半径为100至1000μm的焊球））。倒装芯片组件中SnAgCu焊球的平均过冷度为62℃。通过扫描电子显微镜检查这些不同样品的微观结构。观察到锡枝晶臂宽度随球直径单调增加，表明此类焊球的机械响应可能与尺寸有关。

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来源
《Journal of Materials Research》 |2005年第11期|p.2914-2918|共5页
作者
R. Kinyanjui; L.P. Lehman; L. Zavalij;
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作者单位

Department of Physics and Materials Science Program, Binghamton University, Binghamton, New York 13902;

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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
原文格式 PDF
正文语种 eng
中图分类工程材料学;
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Effect of sample size on the solidification temperature and microstructure of SnAgCu near eutectic alloys

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