Interfacial embrittlement by bismuth segregation in copper/tin-bismuth Pb-free solder interconnect

P. L. Liu; J. K. Shang

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Interfacial embrittlement by bismuth segregation in copper/tin-bismuth Pb-free solder interconnect

机译：铜/锡-铋-无铅焊料互连中铋偏析引起的界面脆化

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Microchemistry and mechanical properties of a copper/tin-bismuth Pb-free solder interconnect were examined in the as-reflowed and aged conditions by in situ auger fracture and interface fracture mechanics techniques. In the as-reflowed condition, the solder-copper interface was highly resistant to fracture, and the fracture mechanism was ductile with the crack path following the interface between the solder alloy and the copper tin intermetallic phase.

机译：通过原位螺旋钻断裂和界面断裂力学技术，在回流和老化条件下检查了铜/锡-铋-无铅焊料互连的微观化学和力学性能。在回流状态下，焊料-铜界面高度抗断裂，并且断裂机理具有延展性，其裂纹路径遵循焊料合金与铜锡金属间相之间的界面。

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《Journal of Materials Research》 |2001年第6期|p.1651-1659|共9页
作者
P. L. Liu; J. K. Shang;
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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
原文格式 PDF
正文语种 eng
中图分类工程材料学;
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专利

1. INTERFACIAL SEGREGATION OF BISMUTH IN COPPER/TIN-BISMUTH SOLDER INTERCONNECT [J] . P.L.Liu, J.K.Shang Scripta materialia . 2001,第7期

机译：铜/锡-铋锡合金互连中铋的界面偏析
2. PartialIv-Constrained Thermomechanical Fatiaue of Eutectic Tin-Bismuth/Copper Solder Joints [J] . C.H. RAEDER, R.W. MESSLER JR., L.F. COFFIN Journal of Electronic Materials . 1999,第9期

机译：共晶锡-铋/铜焊料接头的局部受约束的热机械疲劳
3. Durability of Pb-free solder between copper interconnect and silicon in photovoltaic cells [J] . Gayatri Cuddalorepatta, Abhijit Dasgupta, Scott Sealing Progress in photovoltaics . 2010,第3期

机译：光伏电池中铜互连线和硅之间无铅焊料的耐用性
4. TEM Study of Bi Segregation in the Interconnect of Eutectic Tin-Bismuth Solder and Copper [C] . P. J. Shang, Z. Q. Liu, L. Zhang, 2007 8th International Conference on Electronics Packaging Technology . 2007

机译：共晶锡铋焊料与铜的互连中Bi偏析的TEM研究
5. Solder joint reliability of tin and tin-bismuth finished and refinished tin (SAC/tin lead) SMT packages under temperature cycling test. [D] . Wang, Weiqiang. 2009

机译：在温度循环测试下，锡和锡铋成品和成品锡（SAC /锡铅）SMT封装的焊点可靠性。
6. A Computational Thermodynamics-Assisted Development of Sn-Bi-In-Ga Quaternary Alloys as Low-Temperature Pb-Free Solders [O] . Chih-han Yang, Shiqi Zhou, Shih-kang Lin, 2019

机译：Sn-Bi-In-Ga四元合金低温无铅焊料的计算热力学辅助开发
7. Thermal stability of high temperature Pb-free solder interconnect characterised by in-situ electron microscopy [O] . Zhaoxia Zhou, Li Liu, Changqing Liu 2018

机译：通过原位电子显微镜表征的高温PB的焊料互连的热稳定性
8. Relationship Between Embrittlement Behavior and Interfacial Energies for Copper Wetted with Binary Bismuth-Thallium Liquid Metal Alloys at 650 F [R] . B. J. ROGUS 1966

机译：650 F下二元铋铊液态金属合金润湿行为与界面能的关系

Interfacial embrittlement by bismuth segregation in copper/tin-bismuth Pb-free solder interconnect

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