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首页> 外文期刊>Journal of Materials Science: Materials in Electronics >Development of Sn–Zn lead-free solders bearing alloying elements
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Development of Sn–Zn lead-free solders bearing alloying elements

机译：具有合金元素的Sn-Zn无铅焊料的开发

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Sn–Zn solder alloys have been considered as one of the more attractive lead-free solders since it can easily replace Sn–Pb eutectic alloy without increasing the soldering temperature. However, there are still some problems to be resolved, such as the argument about the poor oxidation resistance and embrittlement behavior. In order to overcome these drawbacks, and further enhance the properties of Sn–Zn lead-free solder alloys, a small amount of alloying elements (rare earths, Bi, Ag, Al, Ga, In, Cr, Cu, Sb, Ni, Ge) added into Sn–Zn alloys were selected by many researchers. For example, a small amount of Al, P, Bi, Ga can improve the high-temperature oxidation resistance of Sn–Zn solders remarkably as well as Cr. This paper summarizes the effects of alloying elements on the wettability, oxidation resistance, melting behavior, mechanical properties, creep properties, microstructures and intermetallic compounds layer of Sn–Zn lead-free solders.
机译：Sn-Zn焊料合金被认为是更有吸引力的无铅焊料之一，因为它可以轻松替代Sn-Pb共晶合金而无需提高焊接温度。但是，仍然存在一些需要解决的问题，例如关于抗氧化性和脆化性能差的争论。为了克服这些缺点，并进一步提高Sn-Zn无铅焊料合金的性能，少量合金元素（稀土，Bi，Ag，Al，Ga，In，Cr，Cu，Sb，Ni，许多研究人员选择了添加到Sn-Zn合金中的Ge）。例如，少量的Al，P，Bi，Ga可以显着提高Cr和Sn-Zn焊料的高温抗氧化性。本文总结了合金元素对锡锌无铅焊料的润湿性，抗氧化性，熔融行为，机械性能，蠕变性能，微观结构和金属间化合物层的影响。

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