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首页> 外文期刊>Journal of Materials Science: Materials in Electronics >Effect of rare earth element additions on the impression creep of Sn–9Zn solder alloy
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Effect of rare earth element additions on the impression creep of Sn–9Zn solder alloy

机译：稀土元素对Sn-9Zn焊料合金压痕蠕变的影响

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摘要

Creep behavior of the Sn–9Zn–RE alloys containing 0.1, 0.25 and 0.5 wt.% rare earth (RE) elements was studied by impression testing and compared to that of the eutectic Sn–9Zn alloy. The tests were carried out under constant punching stress in the range 40–135 MPa and at temperatures in the range 298–420 K. Results showed that for all loads and temperatures, Sn–9Zn–0.25RE had the lowest creep rate, and thus the highest creep resistance among all materials tested. This was attributed to the formation of Sn–RE second phase precipitates which act as the main strengthening agent in the RE-containing Sn–Zn alloys. RE contents higher than 0.25 wt.%, resulted in a lower creep resistance due to a reduction in the volume fraction of Zn-rich phase caused by the formation of Sn–Zn–RE intermetallics. The average stress exponents of 6.8, 6.9, 7.1, 6.8 and activation energies of 42.6, 40.6, 43.0 and 44.9 kJ mol−1 were obtained for Sn–9Zn, Sn–9Zn–0.1RE, Sn–9Zn–0.25RE, and Sn–9Zn–0.5RE, respectively. These activation energies were close to 46 kJ mol−1 for dislocation climb, assisted by vacancy diffusion through dislocation cores in the Sn. This, together with the stress exponents of about seven suggests that the operative creep mechanism is dislocation climb controlled by dislocation pipe diffusion.
机译：通过压痕测试研究了含0.1、0.25和0.5 wt。％稀土（RE）元素的Sn-9Zn-RE合金的蠕变行为，并将其与共晶Sn-9Zn合金的蠕变行为进行了比较。该测试是在40-135 MPa的恒定冲压应力和298-420 K的温度下进行的。结果表明，在所有负载和温度下，Sn-9Zn-0.25RE的蠕变速率最低，因此在所有测试材料中具有最高的抗蠕变性。这归因于Sn-RE第二相沉淀的形成，该沉淀是含RE的Sn-Zn合金中的主要增强剂。 RE含量高于0.25 wt。％，由于Sn-Zn-RE金属间化合物的形成导致富锌相的体积分数减少，导致抗蠕变性降低。 Sn–9Zn，Sn–9Zn–0.1RE，Sn–9的平均应力指数分别为6.8、6.9、7.1、6.8和42.6、40.6、43.0和44.9 kJ mol -1 。 9Zn–0.25RE和Sn–9Zn–0.5RE。这些位错激活的激活能接近46 kJ mol -1 ，这是由于锡中位错核的空位扩散所致。这与约7的应力指数一起表明，有效蠕变机制是位错管扩散控制的位错爬升。

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