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首页> 外文期刊>Journal of materials science >Fabrication of sputtered titanium vanadium nitride (TiVN) thin films for micro-supercapacitors
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Fabrication of sputtered titanium vanadium nitride (TiVN) thin films for micro-supercapacitors

机译:用于微型超级电容器的溅射钛氮化钒(TiVN)薄膜的制备

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摘要

In the present work, we have demonstrated the micro-supercapacitor behavior of titanium vanadium nitride thin films fabricated on stainless steel substrates by a pulsed DC magnetron sputtering technique. The microstructural characterization from X-ray diffraction (XRD) reveals the FCC structure of TiVN thin films with a preferred (200) orientation. A faceted morphology with square-edge shaped dense grains of the thin films is observed from field emission scanning electron microscopy (FESEM) and transmission electron microscopy (TEM) images. Ion scattering spectroscopy (ISS) and X-ray photoelectron spectroscopy (XPS) was used to determine the surface compositions and confirmed the absence of impurities. The specific capacitance (C~(sp)) of the electrode material was evaluated by cyclic voltammetry (CV). Galvanostatic charge–discharge (CD) test and the electrochemical impedance spectroscopy (EIS) measurements were also performed. The electrochemical result of fabricated TiVN displays a supercapacitive behavior. A maximum C~(sp)of 69 F/g (volumetric capacitance of 155.94 F/cm_(3)) is obtained from both CV and CD studies. The experimental results reveal that the sputtered TiVN thin films area promising electrode material for electrochemical micro-supercapacitors.
机译:在目前的工作中,我们已经证明了通过脉冲直流磁控溅射技术在不锈钢基板上制造的钛钒氮化钛薄膜的微超级电容器行为。 X射线衍射(XRD)的微观结构表征揭示了TiVN薄膜的FCC结构具有较好的(200)取向。从场发射扫描电子显微镜(FESEM)和透射电子显微镜(TEM)图像观察到薄膜具有方棱形致密晶粒的多面形态。离子散射光谱(ISS)和X射线光电子能谱(XPS)用于确定表面成分并确认不存在杂质。通过循环伏安法(CV)评估电极材料的比电容(C〜(sp))。还进行了恒电流充放电(CD)测试和电化学阻抗谱(EIS)测量。制备的TiVN的电化学结果显示出超电容行为。通过CV和CD研究得出最大C〜(sp)为69F / g(体积电容为155.94F / cm_(3))。实验结果表明,溅射TiVN薄膜有望成为电化学微型超级电容器的电极材料。

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