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首页> 外文期刊>Journal of Materials Science. Materials in Electronics >Phase Diagrams of Pb-Free Solders and their Related Materials Systems
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Phase Diagrams of Pb-Free Solders and their Related Materials Systems

机译：无铅焊料及其相关材料系统的相图

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摘要

Replacing Pb-Sn with Pb-free solders is one of the most important issues in the electronic industry. Melting, dissolution, solidification and interfacial reactions are encountered in the soldering processes. Phase diagrams contain equilibrium phase information and are important for the understanding and prediction of phase transformation and reactive phase formation at the solder joints. This study reviews the available phase diagrams of the promising Pb-free solders, and their related materials systems. The solders are Sn-Ag, Sn-Cu, Sn-Ag-Cu, Sn-Zn, Sn-Bi, Sn-In and Sn-Sb. The materials systems are the solders with the Ag, Au, Cu, Ni substrates, such as Sn-Ag-Au, Sn-Ag-Ni, Sn-Cu-Au, and Sn-Cu-Ni ternary systems. For the Pb-free solders and their related ternary and quaternary systems, preliminary phase equilibria information is available; however, complete and reliable phase diagrams over the entire compositional and temperature ranges of soldering interests are lacking.
机译：用无铅焊料代替Pb-Sn是电子工业中最重要的问题之一。在焊接过程中会遇到熔化，溶解，固化和界面反应。相图包含平衡相信息，对于理解和预测焊点处的相变和反应性相形成很重要。这项研究回顾了有前途的无铅焊料及其相关材料系统的可用相图。焊料是Sn-Ag，Sn-Cu，Sn-Ag-Cu，Sn-Zn，Sn-Bi，Sn-In和Sn-Sb。材料系统是具有Ag，Au，Cu，Ni基体的焊料，例如Sn-Ag-Au，Sn-Ag-Ni，Sn-Cu-Au和Sn-Cu-Ni三元系。对于无铅焊料及其相关的三元和四元体系，可以获得初步的相平衡信息。但是，缺乏在整个焊接兴趣范围内的成分和温度范围的完整而可靠的相图。

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