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首页> 外文期刊>Journal of Materials Science. Materials in Electronics >Electrochemical migration of lead free solder joints
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Electrochemical migration of lead free solder joints

机译：无铅焊点的电化学迁移

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Electrochemical migration (ECM) tests oil lead bearing and lead free solder joints on Cu lamination oil FR-4 board were conducted by applying constant voltage. This paper first studied the ECM of the soldered joints under distilled water after removing the fluxes. In addition, conditions under high temperature and high humidity were also set up to investigate the changes of the initial surface insulation resistance (SIR) with the residues of no clean fluxes. It is found under distilled water that dendrites of the solder joints take on different morphologies with the different migration elements. For the joints of Sn-37Pb and Sn-36Pb-2Ag solders, the main migration element is Pb. While that of Sn-3.5Ag and Sn-4Ag-0.5Cu solders, it is Cu that usually migrates and forms dendrites due to the poor wettability of the solder paste leads to part exposure of Cu substrate at the wetting brim. For Sn-3Ag-0.5Cu solder joints, Sn leads the migration. While for Sn-Zn-Bi solder joints, it is always Zn to migrate which means Zn is more mobile than Cu. The investigation oil SIR shows the fluxes have great effect oil the migration behavior. The failure time of the joints with the same solder alloy compositions have different failure time due to the different fluxes. The effect of the wettability and the role Of Cu substrate oil the ECM behavior of the solder joints are discussed in detail.
机译：电化学迁移（ECM）测试是通过施加恒定电压在铜箔层压油FR-4板上进行含油轴承和无铅焊点的测试。本文首先研究了去除焊剂后在蒸馏水作用下的焊接接头的ECM。此外，还设置了高温高湿条件，以研究初始表面绝缘电阻（SIR）随清洁助焊剂残留的变化。发现在蒸馏水作用下，焊点的树枝状结晶具有不同的形态和不同的迁移元素。对于Sn-37Pb和Sn-36Pb-2Ag焊点，主要的迁移元素是Pb。 Sn-3.5Ag和Sn-4Ag-0.5Cu焊料中，由于锡膏的润湿性差，通常是Cu迁移并形成枝晶，从而导致Cu基体部分暴露在润湿边缘。对于Sn-3Ag-0.5Cu焊点，Sn导致迁移。对于Sn-Zn-Bi焊点，迁移总是Zn，这意味着Zn比Cu更具迁移性。研究油的SIR表明，通量对油的迁移行为有很大的影响。具有相同焊锡合金成分的接头的失效时间由于通量不同而具有不同的失效时间。详细讨论了润湿性的影响和铜基油的作用，以及焊点的ECM行为。

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