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The Effects of Electromigration to the Solder Joint Formation: A Comparison Between 99.3Sn-0.7Cu and 96.5Sn-3.0Ag-0.5Cu Lead Free Solder

机译：电迁移对焊点形成的影响：99.3sn-0.7Cu与96.5sn-3.0ag-0.5Cu无铅焊料的比较

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Mohd Salleh M. A. A; A. R. Nik Nurhidayatul Suhada; Flora Somidin; Khairel Rafezi Ahmad; Lee C. S; Kamarudin Hussin;
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年度 2016
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1. Effect of Electromigration and Thermal Ageing on the Tin Whiskers’ Formation in Thin Sn–0.7Cu–0.05Ga Lead (Pb)-Free Solder Joints [J] . Noor Zaimah Mohd Mokhtar, Mohd Arif Anuar Mohd Salleh, Andrei Victor Sandu, Coatings . 2021,第8期

机译：薄Sn-0.05Ga铅（Pb） - 完全焊点锡晶须铅晶须形成的电迁移和热老化的影响
2. Effects of graphene oxide on the electromigration lifetime of lead-free solder joints [J] . Ko Yong-Ho, Son Kirak, Kim Gahui, Journal of materials science . 2019,第3期

机译：氧化石墨烯对无铅焊点电迁移寿命的影响
3. Current Crowding And Its Effects On Electromigration And Interfacial Reaction In Lead-free Solder Joints [J] . Hao Lu, Chun Yu, Peilin Li, Journal of Electronic Packaging . 2008,第3期

机译：无铅焊点中的电流拥挤及其对电迁移和界面反应的影响
4. The Effects of Electromigration to the Solder Joint Formation: A Comparison Between 99.3Sn-0.7Cu and 96.5Sn-3.0Ag-0.5Cu Lead Free Solder [C] . Mohd Salleh M. A. A., A. R. Nik Nurhidayatul Suhada, Flora Somidin, International Conference on Manufacturing Science and Technology . 2013

机译：电迁移到焊点形成的影响：99.3sn-0.7cu和96.5sn-3.0ag-0.5cu无铅焊料之间的比较
5. Effect of Thermo-Electromigration on Copper Dissolution and Intermetallic Compound Formation in Flip-Chip Lead-free Solder Joints [D] . Han, Jung Kyu 2011

机译：热电迁移对倒装芯片无铅焊点中铜溶解和金属间化合物形成的影响
6. Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation [O] . Yuan-Wei Chang, Yin Cheng, Lukas Helfen, -1

机译：基于离散空隙形成的倒装芯片焊点失效的电迁移机理
7. Numerical analysis of lead-free solder joints: effects of thermal cycling and electromigration [O] . Zha Xu 2016

机译：无铅焊点的数值分析：热循环和电迁移的影响

The Effects of Electromigration to the Solder Joint Formation: A Comparison Between 99.3Sn-0.7Cu and 96.5Sn-3.0Ag-0.5Cu Lead Free Solder

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