首页> 外文期刊>Journal of Materials Science. Materials in Electronics >Fractal character of in situ heat treated metal-compound semiconductor contacts
【24h】

Fractal character of in situ heat treated metal-compound semiconductor contacts

机译:原位热处理金属化合物半导体触点的分形特征

获取原文
获取原文并翻译 | 示例
           

摘要

The heat treatment of metallized (Au) compound semiconductors (InP) was studied by in situ scanning electron microscopy combined with mass spectrometry. Correlation was found between the change in the surface morphology and the volatile component loss caused by the material interactions taking place during the heat treatment. Our experiments proved that the surface morphology can be characterized by its fractal dimension at the maximum value of the volatile component loss. In this paper the dependence of the fractal dimension of the surface pattern on the heat treatment temperature (in a given temperature range), on the volatile component loss and on metal thickness is described. Changes of the surface morphology on the analyzed samples begin at different temperatures. The evaluated patterns were created describing contour lines of the metal islands on the surface. This island formation known as balling-up phenomenon is due to the heating up of the samples. In the case of the 10 and 30 nm Au/InP(100) samples the fractal behavior appeared nearly at the same temperature (470 degrees C divided by 490 degrees C). The examined thick Au(85 nm)/lnP(100) contact showed a fractal character at a lower (385 degrees C) temperature. Although fractal dimension values could be obtained in a rather wide temperature range the Surface had a real fractal character at only those temperatures where volatile component loss took place.
机译:通过原位扫描电子显微镜结合质谱研究了金属化(Au)化合物半导体(InP)的热处理。发现表面形态的变化与在热处理期间发生的材料相互作用引起的挥发性组分损失之间存在相关性。我们的实验证明,表面形态可以通过其分形维数来表征,该分形维数是挥发性组分损失的最大值。在本文中,描述了表面图案的分形维数与热处理温度(在给定温度范围内),挥发性成分损失和金属厚度的关系。被分析样品的表面形态变化在不同温度下开始。创建评估图案以描述表面上的金属岛的轮廓线。这种岛状现象称为起球现象是由于样品加热所致。在10和30 nm Au / InP(100)样品的情况下,分形行为几乎在同一温度下出现(470摄氏度除以490摄氏度)。所检查的厚Au(85 nm)/ lnP(100)触点在较低温度(385摄氏度)下显示出分形特征。尽管可以在相当宽的温度范围内获得分形维数值,但表面仅在发生挥发性成分损失的温度下才具有真实的分形特征。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号