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首页> 外文期刊>Journal of Materials Science. Materials in Electronics >Degradation of Sn37Pb and Sn3.5Ag0.5Cu solder joints between Au/Ni (P)/Cu pads stressed with moderate current density
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Degradation of Sn37Pb and Sn3.5Ag0.5Cu solder joints between Au/Ni (P)/Cu pads stressed with moderate current density

机译：在中等电流密度下承受应力的Au / Ni（P）/ Cu焊盘之间的Sn37Pb和Sn3.5Ag0.5Cu焊点降解

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摘要

Sn37Pb (SP) and Sn3.5Ag0.5Cu (SAC) ball grid array (BGA) solder joints between Au/Ni (P)/Cu pads were stressed with a moderate current density of 6.0 X 10~(2) A/cm~(2) at an ambient temperature of 125 deg C up to 600 h. The solder joint reliability was evaluated in terms of temperature measurement, microstructural analysis and mechanical strength test. It was confirmed that no obvious electromigration occurred with this moderate current density. However, the local temperature of solder joints rose considerably due to massive Joule heating, which degraded the solder joint reliability seriously. Phase coarsening was observed for both solders and it was particularly apparent in the SP solder joints. Compared to the SP, the SAC was found to be more reactive and hence a thicker intermetallic compound (IMC) was developed during the current stressing. Nevertheless, the IMC thickening was not as remarkable as expected with current stressing at high temperature. It exhibited a sub-parabolic growth manner that was mainly controlled by grain boundary diffusion. However, a sufficiently thick IMC layer initially formed during reflow soldering and the low diffusivity of the Ni atoms retarded the growth. The shear strength of the solder joints was found to decrease severely with the current stressing time. This degradation was attributed to the large stresses arising from localized thermal mismatch, phase coarsening, volume shrinkage of IMC evolution, Ni-P layer crystallization and the pad cracking during current stressing.
机译：在Au / Ni（P）/ Cu焊盘之间施加Sn37Pb（SP）和Sn3.5Ag0.5Cu（SAC）球栅阵列（BGA）焊点的应力为6.0 X 10〜（2）A / cm〜的中等电流密度（2）在125摄氏度的环境温度下长达600小时。根据温度测量，微观结构分析和机械强度测试评估了焊点可靠性。可以肯定的是，在这种中等电流密度下，没有发生明显的电迁移。然而，由于大量的焦耳热，焊点的局部温度显着升高，这严重降低了焊点的可靠性。两种焊料均观察到相变粗，这在SP焊点中尤为明显。与SP相比，发现SAC具有更高的反应活性，因此在电流应力作用下会形成更厚的金属间化合物（IMC）。然而，在高温下电流应力作用下，IMC的增厚效果不如预期。它表现出一种主要由晶界扩散控制的亚抛物线生长方式。然而，在回流焊接过程中最初形成的足够厚的IMC层和Ni原子的低扩散性阻碍了其生长。发现焊接接头的剪切强度随着电流应力时间而严重降低。这种降级归因于局部热失配，相变粗，IMC析出的体积收缩，Ni-P层结晶和电流应力过程中的焊盘开裂而产生的巨大应力。

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