Sinter bonding and formation of a near-full-density bondline at 250 °C via addition of submicrometer Cu particles to micrometer Ag-coated Cu particles

Sung Yoon Kim; Myeong In Kim; Jong-Hyun Lee

首页> 外文期刊>Journal of materials science >Sinter bonding and formation of a near-full-density bondline at 250 °C via addition of submicrometer Cu particles to micrometer Ag-coated Cu particles

【24h】

Sinter bonding and formation of a near-full-density bondline at 250 °C via addition of submicrometer Cu particles to micrometer Ag-coated Cu particles

机译：在250℃下通过加入亚微米Cu颗粒至微米涂覆的Cu颗粒，烧结和形成近全密度键合线

获取原文

获取原文并翻译 | 示例

掌桥外文数据库（机构版） >>

开具论文收录证明 >>

文献代查 >>

页面导航

摘要
著录项
相似文献
相关主题

摘要

Pressure-assisted die bonding at 250 °C in air using a paste containing 2 μm Ag-coated Cu particles (Cu@Ag) and 350 nm Cu particles was demonstrated for power device bonding. At a Cu@ Ag-to-Cu mixing ratio of 6:4, the sinter-bonded dies showed a considerable average shear strength that approached 25 MPa after only 5 min of bonding. Furthermore, a near-full-density bondline and excellent strength, greater than 30 MPa, were achieved after only 10 min. The remarkably rapid improvement in the strength and microstructure was attributed to the generation of pure Cu nanoparticles on the Cu surfaces by in situ reduction during heating for the bonding.

机译：用含有2μM涂覆的Cu颗粒（Cu @ Ag）和350nm Cu颗粒的糊料，在250℃下在250℃下键合的压力辅助模具粘合，用于动力装置粘合。在Cu @ Ag-to-Cu混合比为6：4时，烧结粘结的模具显示出相当大的平均剪切强度，其在仅5分钟的键合后接近25MPa。此外，在仅10分钟后，实现了近乎全密度的粘合线和优异的强度，大于30MPa。强度和微观结构的显着快速改善归因于通过在加热过程中以原位减少在Cu表面上产生纯Cu纳米颗粒。

著录项

来源
《Journal of materials science》 |2020年第19期|16720-16727|共8页
作者
Sung Yoon Kim; Myeong In Kim; Jong-Hyun Lee;
展开▼
作者单位

Department of Materials Science and Engineering Seoul National University of Science and Technology Seoul 01811 Republic of Korea;

Department of Materials Science and Engineering Seoul National University of Science and Technology Seoul 01811 Republic of Korea;

Department of Materials Science and Engineering Seoul National University of Science and Technology Seoul 01811 Republic of Korea;

展开▼
收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
原文格式 PDF
正文语种 eng
中图分类
关键词

相似文献

外文文献
中文文献
专利

1. Die Bonding Using Submicrometer Ag-Coated Cu Particles and Enhancement of Bonding Strength by Resin Infiltration [J] . Lee Chang Hyun, Lee Jong-Hyun Nanoscience and Nanotechnology Letters . 2017,第8期

机译：使用亚微米涂覆的Cu颗粒粘接和通过树脂渗透提高粘合强度的增强
2. Characterization of novel high-speed die attachment method at 225 degrees C using submicrometer Ag-coated Cu particles [J] . Lee Chang Hyun, Choi Eun Byeol, Lee Jong-Hyun Scripta materialia . 2018,第期

机译：使用亚微米涂覆的Cu颗粒在225摄氏度下进行新型高速管芯附着方法的特征
3. Improved sinter-bonding properties of silver-coated copper flake paste in air by the addition of sub-micrometer silver-coated copper particles [J] . Myeong In Kim, Eun Byeol Choi, Jong-Hyun Lee Journal of Materials Research and Technology . 2020,第6期

机译：通过添加亚微米涂覆铜颗粒，改善了空气中银涂覆的铜薄片浆料的烧结性能
4. Influence of Non-Metallic Particles Addition on Wettability, Intermetallic Compound Formation and Microhardness of Sn-0.7Cu Lead Free Solder Paste [C] . N.S. Mohamad Zaimi, M.A.A. Mohd Salleh, A.M. Mustafa Al Bakri, Sustainable materials . 2018

机译：添加非金属颗粒对Sn-0.7Cu无铅锡膏润湿性，金属间化合物形成和显微硬度的影响
5. Spectroscopy of Cu2ZnSnS4 Nanoparticle Inks and Cu2ZnSn(S,Se)4 Solar Cells [D] . ?Campbell, Stephen 2020

机译：Cu2ZnSnS4 纳米粒子油墨和 Cu2ZnSn 的光谱（ S， Se）的 4个太阳能电池
6. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions [O] . Ai Ting Tan, Ai Wen Tan, Farazila Yusof 2015

机译：纳米粒子添加对不同热条件下Cu / Sn-Ag-Cu / Cu焊点中金属间化合物（IMCs）的形成和生长的影响
7. Preparation of Submicroscale Ag-Coated Cu Particles by Multi-Step Addition of Ag Plating Solution and Antioxidation Properties for Different Ag Shell Thicknesses [O] . Choi Eun Byeol, Lee Jong-Hyun 2017

机译：多步加入ag电镀液制备亚微米ag包覆Cu颗粒及不同ag壳厚度的抗氧化性能
8. Controlled Heterogeneous Nucleation of Melt-Textured YBa2Cu3O(6+x) by Addition of Al2O3 Particles. [R] . Chen, Y. L., Zhang, L., Chan, H. M., 1992

机译：添加al2O3颗粒控制熔融织构YBa2Cu3O（6 + x）的非均匀成核。

Sinter bonding and formation of a near-full-density bondline at 250 °C via addition of submicrometer Cu particles to micrometer Ag-coated Cu particles

摘要

著录项

相似文献

相关主题

期刊订阅