Effect of small amount of rare earth addition on electromigration in eutectic SnBi solder reaction couple

Hongwen He; Guangchen Xu; Fu Guo

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Effect of small amount of rare earth addition on electromigration in eutectic SnBi solder reaction couple

机译：少量稀土对共晶SnBi焊料反应对中电迁移的影响

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Effect of small amount of rare earth (RE) addition on electromigration behavior of Cu/SnBi/Cu solder reaction couple (SRC) was investigated with current density of 5 × 103 A/cm2 at room temperature and 100 °C, respectively. Results indicate that tiny RE addition to eutectic SnBi solder alloy can make the energy of interfaces and grain boundaries decrease, restrain the movement of dislocations and grain boundary sliding. Therefore, phase segregation and IMC growth will be effectively suppressed which enhances the electromigration resistance.

机译：以5×10 3 A / cm 2的电流密度研究了少量稀土（RE）对Cu / SnBi / Cu焊料反应对（SRC）电迁移行为的影响分别在室温和100°C下。结果表明，在共晶SnBi焊料合金中添加微量RE可使界面能和晶界能量降低，抑制了位错运动和晶界滑动。因此，相分离和IMC的生长将被有效地抑制，从而增强了电迁移耐受性。

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《Journal of Materials Science》 |2009年第8期|p.2089-2096|共8页
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Hongwen He; Guangchen Xu; Fu Guo;
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1. Effect of small amount of rare earth addition on electromigration in eutectic SnBi solder reaction couple [J] . He HW, Xu GC, Guo F Journal of Materials Science . 2009,第8期

机译：少量稀土对共晶SnBi焊料反应对中电迁移的影响
2. Effects of trace amounts of rare earth additions on the microstructures and interfacial reactions of Sn57BilAg/Cu solder joints [J] . Cuiping Wu, Jun Shen, Changfei Peng Journal of materials science . 2012,第1期

机译：微量稀土对Sn57BilAg / Cu焊点组织和界面反应的影响
3. Effects of trace amounts of rare earth additions on the microstructures and interfacial reactions of Sn57Bi1Ag/Cu solder joints [J] . Cuiping Wu, Jun Shen, Changfei Peng Journal of Materials Science: Materials in Electronics . 2012,第1期

机译：痕量稀土元素对Sn57Bi1Ag / Cu焊点微观结构和界面反应的影响
4. Influence of mixed rare earth addition on the microstructure of the Sn-Cu-Ni solder and interfacial reaction of Cu/Sn-Cu-Ni/Cu joints [C] . Wei Li, Min-Bo Zhou, Xiao Ma, 2011 12th International Conference on Electronic Packaging Technology High Density Packaging . 2011

机译：混合稀土添加对Sn-Cu-Ni焊料微观结构和Cu / Sn-Cu-Ni / Cu接头界面反应的影响
5. The Electromigration Behavior of the SnBi System: Implications for the Reliability of Low Temperature Solder Joints [D] . Hadian, Faramarz. 2020

机译：SNBI系统的电迁移行为：对低温焊点可靠性的影响
6. The Effect of Rare Earths Additions on the Microstructure and the Corrosion Behavior of Sn-0.7Cu-0.075Al Solder Alloy [O] . Wenchao Yang, Zaixiang Du, Shuyuan Yu, 2019

机译：稀土元素对Sn-0.7Cu-0.075Al钎料合金的组织和腐蚀行为的影响
7. The Effect of Rare Earths Additions on the Microstructure and the Corrosion Behavior of Sn-0.7Cu-0.075Al Solder Alloy [O] . Wenchao Yang, Zaixiang Du, Shuyuan Yu, 2019

机译：稀土添加对Sn-0.075 - 0.075焊料合金的微观结构和腐蚀行为的影响

Effect of small amount of rare earth addition on electromigration in eutectic SnBi solder reaction couple

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