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首页> 外文期刊>Journal of nano research >Microstructural Investigation of CNT-metal Bonding Behavior through Computational Simulations
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Microstructural Investigation of CNT-metal Bonding Behavior through Computational Simulations

机译：碳纳米管与金属键合行为的微观结构研究

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Mechanism of CNT-metal bonding is investigated using molecular dynamics in this study. Both bonding and debonding processes are considered. It is shown that the bonding can be achieved at a temperature lower than the melting point. The surface melting and capillary wetting dominate the bonding process. In addition, there are two potential failure positions, one is at CNT-Ni interface and the other is at nickel surface which are determined by the strength competition of these two interfaces. To obtain high bonding strength, we should form coalescence structure between CNT and the metal at a higher temperature to achieve larger contact length. Also we find that the debonding process experiences elastic deformation followed by debonding at CNT-Ni or Ni-Ni interface.
机译：本研究利用分子动力学研究了碳纳米管与金属的键合机理。结合和分离工艺都被考虑。结果表明，可以在低于熔点的温度下实现键合。表面熔化和毛细润湿占主导地位。此外，存在两个潜在的失效位置，一个位于CNT-Ni界面，另一个位于镍表面，这取决于这两个界面的强度竞争。为了获得高结合强度，我们应该在较高温度下在CNT与金属之间形成聚结结构，以实现更大的接触长度。我们还发现，脱胶过程经历了弹性变形，然后在CNT-Ni或Ni-Ni界面脱胶。

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